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Study On The Preparation And Property Of EVA Thermal Conductive Co-film Applying To Photovoltaic Encapsulation

Posted on:2013-11-29Degree:MasterType:Thesis
Country:ChinaCandidate:W B FanFull Text:PDF
GTID:2231330371986199Subject:Materials Processing Engineering
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With the development of the world, human’s need to energy become more and more rigorous,traditional energy mostly belongs to nonrenewable resources, and usually leads to environmentalpollution; while solar energy has been in the limelight as a clean energy source that isinexhaustible and inexhaustible, crystalline silicon solar cells is an device that can tranceformsolar energy into electrical energy, to realize the purpose of the use of solar energy, has the verygood application prospects. while much quantity of heat produce as solar cells generateelectricity that leading to the temperature rise of the device, which will has a huge impact to thesolar cells, Through the analysis of the module cooling way, it can be found that powergeneration efficiency of silicon solar cells can be improved by enhancing thermal conductivity ofsolar module. ethylene vinyl acetate (EVA) copolymer located in the lower of the device has norequirement to light transmittance, If we can improve the thermal conductivity of the EVAcopolymer via filling thermal conductive filler, the cooling efficiency of device can be improved.So this paper take T-ZnOw T-ZnOw/ZnO T-ZnOw/AlN as thermal conductive filler to fill EVAcopolymer, As to prepare the copolymer that with high thermal conductivity, at the same timedielectric protecties, mechanical property, thermal stability, and degree of cross linking meetsrequirements.This paper mainly studied on some aspects as follows:(1) The thermal effect of EVA copolymer filled with T-ZnOw. hybrid system T-ZnOw/ZnO andT-ZnOw/AlN was studied, determine the best ratio of hybrid system, the result shows that thebest volume ratio was4:1, three system show the same variation trend with the increase of filler,before5%of volume content, Thermal conductivity increased slowly, between5%and15%,Thermal conductivity increases rapidly, after15%, the increase of thermal conductivity began toslow.(2) The dependence of thermal conductivity of co-film of packing interface processing wasstudied, using the quality dosage of1.5%KH570and stearic acid to tread with T-ZnOw, ZnO, AlN, the result shows that different surface treatment appears different effect,T-ZnOw,AlNtreated with KH570was superior to stearic acid, while ZnO treated with stearic acid wassuperior to KH570.(3) The dependence of volume resistivity of EVA co-film on three system’s volume content wasstudied, the result shows that three system show the same variation trend with the increase offiller, before5%of volume content, Volume resistivity change little, after5%, Volume resistivityslow rapidly, as a whole, before15%of volume content, dielectric protecties meet the pvpackaging materials application requirements.(4) The dependence of tensile strength of EVA co-film on three system’s volume content wasstudied, the result shows that three system show the same variation trend that climb up and thendecline with the increase of filler, at the volume content of10%, tensile strength reach biggest, asa whole, before20%of volume content, tensile strength meets the pv packaging materialsapplication requirements.(5) The dependence of thermal stability on the filler was studied, the result shows that eachsystem packing could improve the thermal stability(6) crosslinking of EVA co-film was studied, the optimum experimental conditions weredetermined: the quality dosage was1.5%, Crosslinking temperature was150℃, crosslinkingtime was30min.crosslinking pressure was5MP. the dependence of thermal conductivity andvolume resistivity on crosslinking was studied, the result shows that thermal conductivity andvolume resistivity improved slightly after crosslinking; the dependence of degree of crosslinkingof three system’s volume content was studied at last, the result shows that defferent filler hasdifferent effect to the crosslinking,T-ZnOw and AlN reduce the activity of initiator, while ZnOincrease the activity, as a whole, before15%of volume content, degree of crosslinking meets thepv packaging materials application requirements.
Keywords/Search Tags:EVA co-film, fillers, thermal conductivity, volume resistivity, thermal stability, Crosslinking
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