| In this paper, the high density polyethylene-based conductive composite filled withthe graphene microplate(KNG150) through the melt blend method, supplied byXiamen Knano Graphene Technology Corporation Limited, was investigated. Thecomposite has showed well electronic transport characteristic and positivetemperature coefficient(PTC) characteristic. This conductive composite was fullproven and analysised by means of scanning electron microscope(SEM), differentialscanning calorimetry(DSC), thermal gravimetric analysis(TGA) and so on.The high density polyethylene PTC conductive composite was filled with graphenemicroplate through melt blend method, the effects of the factors of prepere method,conductor filler, processing technic and the second based plastic on the electronictransport characteristic and the PTC characteristic were investigatived. Theelectrology and thermology characteristic of the HDPE/KNG PTC conductivecomposite were tested and analysised, and the microscopic appearance of thiscomposite were also been observed by means of SEM and TEM. Though the aboveanalysis and investigation, some conclutions were obtained. The composite preparedfrom melting method was superior to that prepared from solution method not only onthe aspect of the electronic characteristic but also on the aspect of the PTCcharacteristic, on the situations of molding temperature was150℃, molding presswas20MPa, and at100℃under controlled pressure and temperature annealingtreatment for10mins. When the polypropylene was introduced into the composite asthe second basic plastics, the electronic characteristic and PTC characteristic had awell promotion than the composite without the polypropylene, moreover the specificvalue of polypropylene to polyethylene was3:7, the intensity of PTC reach5.58orderof magnitude. At the meantime, the negative temperature coefficient(NTC) effect waseffectively inhibited, reduced to0.29magnitude, showing a very good stability on thehigh temperature. |
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