| A tester for measuring the wetting force of common solder alloys has been developedbased on the wetting balance method. The control programs in PC are developed byLabVIEW, and communicate with subsystems through NI-VISA. Subsystems consists offorce-measuring system, motion and heating system, which are connected with PC by serialport, and accomplish the function of wetting force measuring, mechanical moving andtemperature controlling and insulation respectively, thus finish the process of wettingbalance curve measuring under related standards, then characteristic values are extractedfrom the curve by internal algorithm and saved as html documents, which could be studiedby researchers. The equipment can measure the wetting curve of different electroniccomponents with different solder system. By analysis the result of curves, researchers canevaluate wettability of different base materials, solder system and the flux, and improve theprocess of electronics manufacturing and product reliability. Compared with the existingsimilar products in the market, this equipment has a simpler structure and lower cost, while itis easy to operate and also accurate.Another tester based on area spreading method has been developed mainly for solderpreforms. A dynamic wetting test method has been used. The tester use CCD to dynamicallyobserve and real-timely record the melting process of the solder preforms, measuring areachange during the melting by software, then obtain area spreading vs. time curve, thencharacteristic values are extracted from the curve which are used to evaluate the wettabilityof solder preforms. The tester solves the situation of lacking of method and device of solderpreforms wettability testing, which is a help for the quality improvement of solder preforms. |
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