The performance of super-hydrophobic surface on metal in self-cleaning, antioxidant,anti-fouling studies have a great deal of prospect with important and industrial application.Pure copper in industry and life has a pivotal position, therefore, by a certain materials for thesuper-hydrophobic, which can anti-corrosion and achieve longer application. In this report,author report two simple and quicker technologies for producce super-hydrophobic films.Using those technologies, the author succeeded producce of super-hydrophobic films onmetallic copper substrates.(1) The super-hydrophobic film on copper surface was prodeced by means of one-stepsolution-immersion in palmitic acid and ethanol. The suitable condition of producing thesuper-hydrophobic film on copper is that the copper is immersed in0.03mol/L palmitic acidin ethanol solution at20℃~22℃for144h.The super-hydrophobic film above-mentionedwas characterized and analyzed by SEM, contact angle goniometer, FTIR and high precisionelectronic balance respectively. The results show that the grass-like Cu(CH3(CH2)14COO)2isabout100μm~200μm in size. CA of super-hydrophobic surface is150°. Thesuper-hydrophobic surface on copper has good properties of anti-fouling.(2) The hydrophobic film on copper surface was prodeced by etching of acids (nitcicacid, dihydrchloride, ice acetic acid), alkalis (sodium hydroxide, potassium hydroxide) andsalt (cupric nitrate basic, ammonium peroxydisulfate), the as-prepared copper surfaces werehydrophobized with fluoroalkyl. The above-mentioned films were analyzed by SEM, contactangle goniometer and digital cameraas. The suitable condition of producing the hydrophobicfilm on copper is that the copper is immersed in5mol/L HNO3-1.2mmol/L CTAB at20℃~22℃for20h, the pit micro cluster is about90nm~120nm, CA of hydrophobic surface is104°. The hydrophobic dislocation on copper surface was etched by HCl-CH3COOH, CA ofhydrophobic surface is133°. The sleek black hydrophobic film on copper surface wasprodeced by etching of NaOH-(NH4)2S2O8.The triangle flake structure hydrophobic film oncopper surface was prodeced by etching of NaOH-Cu(NO3)2.The flower structurehydrophobic film on copper surface was prodeced by etching of KOH-K2S2O8. |