Solder Joint Height Detection Device Of The Optical System Design

Height information is the most important information in analysing of object three-dimensional Morphology. Order to study the three-dimensional topography of small solder joints, we need to measure the height of solder joints. Currently, For the technique of the measuring height of objects, the number of measurement of tiny height should be completed, for the small height of the measurement accuracy doesn’t require high. For the shortcoming of traditional measurement technique, this paper present a method of measuring solder joint height.It applies white parallel light exposure stripes board, then make It image projected onto the object which be tested. With the modulation of the object height profile, forming a distorted bright-dark stripes. the three-dimensional information of the solder joints are carried by the fringe pattern, then the distorted of the fringes are shooted on to the CCD by the camera system, by the CCD image processing, then the height information is restored.Uniformly-spaced images of the striped panels projected onto the measured object surface are realized by this method, the image processing errors caused by the projection stripes of different widths are avoided, provided a new way for the tiny height measurement.