Printed Electronic Preparation And Properties Of The Conductive Ink Is Used To Study

Conductive inks, which have become a key material of the printed electronicstechnology in electronics industry, have a great significance in the fields of science anddevelopment. A large number of experiments are done during the course of this paper,the conductive inks using graphite/carbon black, silver nanoparticles, and coppernanoparticles as conductive fillers have been researched. The relationships between thedifferent conductive fillers and conductive properties have been also studied.The epoxy resin was subsequently blended with flake graphite/carbon black togenerate a conductive ink. The mechanisms of conductive were analyzed. Therelationship between electrical conduction and filler content was studied. Theexperimental results indicated that the resistivity of the conductive ink with15%flakegraphite and20%carbon black was up to27.6·cm, the voltage-current characteristicof the conductive inks showed a nonlinear behavior, and the inks possessed a notablepositive coefficient （PTC）. A lot factors affecting the conductivity of inks were alsoanalyzed. Conductive ink exhibited excellent conductivity when the tetrabutyl titanate,polyethylene glycol and tributyl phosphate contents reached at5wt%,0.5wt%and0.3wt%, respectively.Ethylene glycol and aniline were used as reducing agents, poly vinyl pyrrolidone as aprotecting agent, then three different shapes silver particles were synthesized viachemical reduction method using silver nitrate as raw material. The experiments studiedthe effects of the following factors such as the doses of protecting agent, theconcentration of silver nitrate, reaction temperature and reaction time etc. on the particlesize and morphology of the silver powders. The morphology, crystallographic structure,and optical properties were determined by transmission electron microscope （TEM）,X-ray diffraction （XRD）, and UV-vis absorption spectroscopy. The mean size of spherenanoparticles is50nm; the silver nanorods are100nm in diameter and5μm in length;the average edge length and thickness of silver flakes are about800nm and29nm. Andthen they were used to study the shape influence on the electrical property, thermalstability, and mechanical properties of the conductive tracks. The resistivity variation and microstructure of the silver conductive inks was monitored as a function of fillerscontent using a four-point probe and scanning electron microscopy as well as thermalanalysis. We proposed the possible formation mechanism of conductive inks withdifferent fillers. It demonstrated that the conductive inks filled with silver nanorods andnanoparticles could achieve the volume electrical resistivity of2.510^-5·cm aftersintering at160oC for20min. The conductive ink exhibits high mechanical propertiesand thermal stability.The copper nanoparticles were prepared by using CuCl₂·2H₂O as precursor andL-ascorbic acid as reducing agent. The monodisperse copper particles are spherical inshape. The mean particle diameter observed is about200nm. The mechanism ofL-ascorbic acid on the reduction and stabilization of copper nanoparticles is alsodiscussed. The conductive inks were prepared by using the as-prepared copper powderas conductive fillers. The volume electrical resistivity is4.610^-3·cm. Hence, silverconductive inks had the lowest electric resistivity and an excellent thermal stability, andit is better to use it on the required applications such as fine circuit.