Research And Comparison On IC Level ESD Test Method

With the development of household, hand-held and automobile electronics and the intelligent demand of all kinds of terminal equipment, more and more microcontrollers are used. With the push of increasingly fierce matket competition, terminal equipment manufacturers need to do the best to reduce the cost of their product, such as reduce the PCB board space and system design space. But the product must get the compulsory product certification, the terminal equipment manufacturers request better electromagnetic compatibility of the integrated circuit which are used in the system product. The IC electromagnetic compatibility testing and studies has become the focus of research at home and abroad. In the real testing, the IC which has passed the three kinds of IC-level ESD test and latch-up test, has a bad performance in system ESD testing. This means that the IC-level EMC testing can’t completely simulation the system level ESD testing. The IC producers need a new IC-level ESD test method.This paper compares and analyses the IC-level ESD test, latch-up test and syste-level ESD test in the form of source, coupling path and victim, and summarize the shortage of IC-level testing. Based on current IC-level EMC testing in which the IC are powered, this paper comes up with a new IC-level ESD testing, confirm the reliability and repeatability of the new test and provides a reference to IC ESD test and ESD protect circuit design.