The FVS Technology Development Based On Genesis And Minitab Software

The rapid development of communication technology the make electroniccommunication devices with fast signal transmission characteristics(such as the wirelesstransmission,3G Internet phone etcs) to have a wide range of applications, which putforward higher requirements for the design and manufacture of printed circuit boards,base on high frequency and fast trends of electronic signal transmission, the design andmanufacturing of high-speed digital printed circuit board (PCB) which can handledigital signals in the gigahertz range, become one of the key technologies of design andmanufacturing of the printed circuit board industry, the relevant technologiesdevelopment become a hot spot of the industry’s concerns.In the layout design of high-speed digital printed circuit board, it is often necessaryto use micro-strip or with the assembly line, in order to make the design producs can beeasy to transmit digital signals in the high frequency range of1GHz to10GHz. In orderto meet the development requirement of light-weight, low-profile, the printed circuitboard use multi-layered strategy which is become basic means of the development ofnew products, it is more compacter printed circuit board which is made up of more thanone circuit layer printed circuit boards. Currently, in this compact, multi-layers printedcircuit boards, electrical communication between the different circuit layer can beimplement by through-hole technology. Achieve the electrical communication betweenthe different layers by the electronic circuit of PTH hole which is form PAD to otherPAD of PTH. However, the direct result of this measure will produce a large number ofparasitic inductance and capacitance. From the basic principle, each via hole willproduce a parasitic inductance and capacitance (the hazards of the parasitic inductanceof the high-frequency signal is greater than the parasitic capacitance). In fact, theparasitic series inductance of the through holes would weaken the contribution of thebypass capacitor, weaken the effectiveness of the whole system, and affect the integrityof the transmission signal, which is very detrimental to carry out the electronicalfunction of designed production. In high speed digital printed circuit boards, backpanlebear the weight of function board (function board is the real part which achieve system’s performance), responsible for the transmission signal between all function board, assistfunction board to achieve the overall performance, and ultimately achieve the systemfunctions, which are common industry means, widely used in the server andcommunications base station. In different product design, according to differentperformances of function boards, backpanle generally bear the weight of5-10fuctionboards. For reliability reasons, backpanle are mostly passive board. Therefore, theinfluence of the the vias parasitic problems on high-frequency signal is more apparent inthe high-speed backpanle, eliminating parasitic vias is very necessary.For technical problems which exist in the manufacturing field of printed circuitboard at present, thesis use printed circuit board process as the research object. Holesseparated technology (Founder Via Separation, FVS), use Genesis software engineeringto implement design, to eliminate hole parasitic impact of high-frequency signals, toimprove signal integrity. By the theoretical study of plating the entire holes, activation,base on the principle of plating copper, to develop a material which can’t be platingcopper, we call it PPR(Plating Separation Stop), which enhance the quality of the holemetallization; by studying core technologies of processing of PCB—plug holetechnology, screen printing technology, grinding technology etcs, achieve themachinability of FVS technology of manufacturing backpanle By detailedly study of thereliability demand and the reliability test means which FVS technology apply inmanufacturing of communication backpanle through-hole, achieve the test means whichapply in FVS technology. Using Minitab software to design experimentation, throughthe analysis of experimental data, optimizing prcess and methods, achieve the siticinductance effects of simulation hole, that is, L=5.08H [ln (4H/D),D is the diameterof the center drill; L is the inductance of the hole; H is the length of the through-hole.The study shows that the diameters of the vias have small influence on the inductance,but the lengths of the through-hole have great influence on the inductance.The technology achieve practical applications in industrial production, to provethat the the FVS board of the research and development has meet the reliabilityrequirements, to obtain a high economic efficiency, to achieve a expectant target of thestudy.