The Research Of Micro/Nano Transfer Patterning Based On PDMS Mold

Micro/Nano transfer patterning technique is an effective approach for fabricating micro/nano structure and devices as one of the unconventional micro/nanopatterning techniques. Micro/Nano transfer patterning technique includes positive transfer patterning, subtractive transfer patterning, transfer printing and ink transfer, and ink transfer technique has a broad applications in micro/nano manufacture as its low cost, avoiding high temperature and pressure and easily being applied in Roll-to-Roll fabrication. In this paper, PDMS mold is used in ink transfer experiments, the mechanism of SU-8photoresist and silver ink transfer are illustrated, the influence of technological parameters on ink transfer technique is discussed, which could supply essential theoretical direction for the research and application of ink transfer.Transferring SU-8dot array structure based on PDMS micro-cavity mold. The two critical processes, SU-8photoresist filling into the micro-cavities in the PDMS mold and the cured SU-8photoresist being transferred, are studied. Research the effect of the contact angle and aspect of micro-cavity on the filling process; Improve ink transfer process latitude with surface modification technology based on adhesion work between different materials; Optimize transfer pressure to effectual control the height of the dot array using FEM analysis; Clarify the influence of solvent evaporation on transfer accuracy through experiments using SU-8photoresist with different solute concentration. These results provide theoretical basis for the selection and improvement of various process permanents.Transfer silver lines structure based on PDMS groove mold. A novel method without additional force to realize silver ink to fill the grooves is presented:silver ink fills into the grooves making use of the ink discontinue dewetting the grooves in the direction parallel and perpendicular to the grooves. Simulate the phenomena of silver ink discontinue dewetting the grooves in the direction parallel with the trenches, and the simulation results coincide with the experiment results; Transfer the silver lines from the bottom of the grooves to glass substrate using liquid-bridge-mediated nanotransfer technique; Illustrate the influence of baking temperature and time on the continuity of silver lines, the solvent of the liquid-bridge dissolving the silver lines and luminousness of silver lines. These researches offer a novel approach for fabricating graphical metal structure, and supply theoretical support to metal ink transfer.