Effect On Demolding Properties Of High Current Pulsed Electron Beam In Hot Embossing

In hot embossing, it is offen leaded polymer to twiste, tensile, and even destroye bymould mucosa problems. More serious is that polymer is adhesived the surface of the mold,it can destroye microstructure of the mould, caused heavy losses. It aimed to improvedemoulding performance and performance of the mould by HCPEB in this topic. The mainworking contents as followed:(1) Analysis of the moulding forces in the embossing. In our work, the demoldingforces mainly consist of thermal shrinkage stress and adhesive forces. And selectivealysised the influence of adhesive forces through tribology theory and some viscoelastictheory, it is considered that interface adhesion between the polymer and the die surface asthe main source of the adhesive forces. If interface adhesion decreased, and adhesiveforces decreased, too. Adhesive forces can be descrease by decreasing the interfaceadhesion of the die. It suggest the oretical principle our research to improve demouldingperformance by HCPEB.(2)Study of the egular of the surface morphology, organization and properties ofNi200after irradiated by HCPEB. This part of the research contents accelerate voltage andpulse frequency. The results show that the friction coefficient and rate of wear decreasedrespectively by46.7%and86.6%for27KV,25pulses after treated by HCPEB, and alsothe friction coefficient and rate of wear decreased respectively by33.3%%and69.8%for24KV,25pulses. And surface roughness is reduced and micro hardness is improved. Theoptimizational parameters of HCPEB is improved for the following researchthrough the experiment.(3) Study of the wettability of Ni200after irradiated by HCPEB. Wettability test candirectly reflect the work of adhesion, and is good test to the research. Through thewettability test, the optimizational parameters of HCPEB can also gained. It improvedtheoretical basis for the topic. The results show that the contact angle is largest for24KV,25pulses when the wettability and interface adhesion is low, and the angle is110°Which is increased by about21.9%. And demoulding performance is improved.(4) Made experiments through the simple die. The results show that there is nodamage and tear phenomenon between the polymer and the die surface if the die is treatedby HCPEB. However if the die isn’t treated by HCPEB, some damage and tear phenomenon will happen between the polymer and the die surface. The results show thatdemoulding performance was improved after irradiated by HCPEBIn this topic, we can conclude that under the proper irradiation parameters, the HighCurrent Pulsed Electron Beam(HCPEB) technology can be used to reduce adhesion thepolymer and mold, so it can be used to improve demoulding performance in hotembossing.