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The Characterization Of The Interface Adhesion Energy For Metal Film And Analysis Interfacial Failure

Posted on:2014-03-07Degree:MasterType:Thesis
Country:ChinaCandidate:L L WuFull Text:PDF
GTID:2251330401990592Subject:Materials Science and Engineering
Abstract/Summary:PDF Full Text Request
With the development of science and technology, new materials are beingdeveloped and used. Film materials are widely used for its special structure andfunction, however film materials will fail under complex operational environment.The interface failure is the common form of material failure. The interface adhesionenergy is proposed to characterize the quality of the interface, while to measure itaccurately and simply is difficult. The interface of the film will fail when the interfaceadhesion energy is low in deformation. Therefore, to find an effective method tomeasure interface adhesion energy is of great significance. In this paper, firstly thewhole deformation process was simulated using the finite element method. Then theexpression of the interface adhesion energy of the film was established by simulatingthe blister test. At last, what effect of the process parameters have on the interfacialproperties was studied. The main research contents and results are summarized asfollows:(1)Film deformation was simulated by selecting the extended finite element(XFEM) and cohesive element of the finite element software ABAQUS. In thesimulation, the extended finite element was used to analyses the formation andpropagation of surface crack while the cohesive element was used to analyses thedelamination of film material in deformation. The whole process can be illustratedclearly by analyzing the results that get from the simulation such as the parametersSTATUS and SDEG. The result can reflect the film failure process.(2) The expression of the interface adhesion energy was established based on theblister test simulation. When the two dimensions and three dimension blister modewere established in whole process, the cohesive element were used to characterizedthe interface between film and substrate. In the whole process, the blister test wassimulated under different interface adhesion energy with a constant radius firstly.Secondly, the simulation was repeated by choosing different interface adhesionenergy with different radius. Finally, the expression of the interface adhesion energywas obtained through analyzing the date that get from the simulation. The expressionhas many advantages such as simple form and convenient measuring. Furthermore,the expression was verified by blister experiment. (3) The last analysis illustrated how interface adhesion energy affect thedeformation progress of film material was analyzed. How the parameter SDEGchanged in deep-drawing progress under different radius and friction coefficient werelearned with constant interface adhesion energy. By analyzing these parameters someconclusion can be obtained as follows, the interface failure would reduced byincreasing shoulder radius and decreasing friction factor; the yield would be improvedat the same time; otherwise cracks on the film surface produced in deformationwould aggravate the surface failure.In this paper the expression of the interface adhesion energy was established bysimulating the blister test using the finite element software ABAQUS. How theinterface adhesion energy affects parameters of the deep-drawing process was alsolearned. All of the study can optimize process parameters and direct practicalproduction.
Keywords/Search Tags:XFEM, Cohesive element, Blister test, Interface adhesion energy, Deep-drawing process
PDF Full Text Request
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