Research On Simulation And Experiment Of Grinding Optical Glass With Single Diamond Girt

Nowadays as the application of optical glass, ceramics and other brittle materials are expanding rapidly, the requirement for the quality of optical elements are accordingly increasing. But surface/subsurface damage are inevitably introduced in the process of grinding, so how to minimize the damage become the most hot and difficult topic in the areas of manufacturing. However, the research on the grinding mechanism, surface and subsurface damage cracks mostly focus on indentation fracture mechanics, static or quasi-static loading conditions, the dynamic impact factor isn’t taken into account.So this article from the perspective of the dynamic impact to study the surface/subsurface cracks of K9optical glass,It provide a theoretical basis for improving the quality of the surface and reducing the damage of subsurface. To sum up, this issue carry on some specific researches as following areas:First,in this paper ANSYS/LS-DYNA finite element software was used to establish the relevant physical models and material models to simulate the dynamic impact of single abrasive grinding experiment. Then according the results of the simulate to analyze the influence of the dynamic impact on material removal and subsurface damage. Explore the form of cracks spread and chipping phenomenon during the process of grinding.Second,nano-scratch and micro-indentation tests were conducted and then got the surface morphology of grooves and the size characteristics of the indentation through scanning electron microscope (SEM) and digital microscope. At last calculated the basic capacity parameters of the K9such as hardness, fracture toughness and the critical cut. Had got some understanding on the removal mechanisms of K9in the case of static loading.Finally,single-grit diamond grinding test was carried out on MUGK7210X5ultra-precision grinder and monitored by Kistler dynamometer during the grinding process, analyzed the effect of dynamic impact on forces and surface/subsurface damage during the removal of materials.