Molecular Dynamics Simulation Of Joining Process Between Metal Nanowire

The development of the microelectronics industry couldn’t keep up with theMoore’s law since the time entered the21th century. As the circuit dimension isbecoming smaller and quantum effect is becoming a key problem, the electrondevice with nanometer dimension is becoming popular. The gold and silvernanowiresare taken into consideration for their excellent electrical, mechanical andweld-ability properties. However, data deficiencies and joint process problems areexisted for people just transform the micro-interconnection process to the gold andsilver nanowires. Therefore, the study on the gold and silver nanowires joint processand properties test has the important researching significance.In this paper, molecular dynamic method is used to simulate the joint process ofhead to head, head to side,"T" style and " X" style metal nanowires. The same metaljoint between gold and gold and the different metal joint between gold and silver areanalyzed. The process parameter of temperature, diameter and pressure is taken intoconsideration to study the influence on the joint. The mechanical and thermalproperties of the joint are also simulated.The results show that there are two stages in the joint process. The first stagehappens atom diffusion and the second appears new atom bonds. The joints of thehead to head, head to side,"T" style and "X" style are excellent. The coordinationnumber in each kind of joint is low. The diameter of the nanowire affects the jointstructure and the metal joint with diameter is2nm shows the quantum properties.The temperature affects the atom diffusion and offers energy to afford the newbonds.The atom diffustion is becoming steady when the temperature is higher thanthe constant value which is not able to form the whole new bonds. The pressure inthe process will promote the perfect nanowire joint for the atom potential isincreased. The pressure has no difference to the joint between the gold and silvernanowire on the corrdiation number. The mechanical simulation shows that the endto end style joint which belongs to the ductile fracture has the highest tensilestrength. While the Y direction of the head to side,"T" style and "X" style jointstensile propersities are brittle fracture. The HCP faults are formed in the tensile testprocess.