Preparation And Study On Properties Of Phenolic Resin Modified By Silicone

Phenolic resin is an organic synthesis made up of phenol or the homologous series by the condensation reaction. As one of the three resins(epoxy resin,phenolic resin and UPR),it is widely used in the electronic and electrical, autombile making and engineering industry because of the good electrical insulation property, mechanical property, ablation property, decay resistance and better heat resistance and water tolerance. But the nature of ordinary phenolic resin limit itself to the use of many domains. For example, the close-packed rigid aromatic ring which is conjoined with the methylene makes phenolic resin show its large fragility; the phenolic hydroxy and methylene which are oxdized reduce phenolic resin’s heat resistance and oxidative resistance. So in order to meet higher and higher performace requirements, the phenolic resin’s modification becomes the hotspot in the current research.In this paper, we prepare and characterized dodecyltrimethoxysilane modified phenolic resin. The results of Fourier transform infrared spectroscopy(FT-IR)proves tha chemical reaction occurred between dodecyltrimethoxysilane hydrolysis and PF matrix. TG-DTG analyses shows that the modified phenolic resin has a good heat resistance, the temperature of initial decomposition of the condensate is320℃, the resin’s weight-loss ration is only16.92%, the fast temperature spot of the degradation rate is492.8℃,the process of the weightlessness mainly happens between400and600℃,the carbon yield is50%in the800℃. DSC sums up that the resin system’s approximate gelling point is132℃,cuing temperature is153℃,postprocessing temperature is187℃, it provides some evidences for the modified phenolic sheet’s curing process parameter. Using the Kissinger, Ozawa and Crane equation, the cuing reaction system’s average apparent activation energy is57.4KJ/mol, reaction order is0.886. It illustrates the curing reaction of the modified phenolic resin is a complex reaction.On the basis of the confirm of the curing process, we manufacture the composite material-laminated board by the modified phenolic resin. It indicates that the impact toughness and the bending strength of modified phenolic resin by the organosilicone have a better promotion compared with the unmodified phenolic resin. We compare the modified phenolic resin’s carbon fiber laminated board to the glass fiber laminated board and find that the enhancement of effect of the carbon fiber is better than the glass fiber. But the cross section analysis by SEM we find that dodecyltrimethoxysilane added may increase the invasion of the glass fiber.