Research On Mechanism Of Contact Type Ultrasonic Vibration In The CMP

Ultrasonic polishing technology is a new technology which improve the quality of thesurface of silicon wafer. It has a larger advantage compared to the traditional technology ofchemical mechanical polishing (CMP) in the quality and efficiency of polishing. It has manyfactors that affect the polishing and the process is also complex, so many scholars have nouniversal answer to polishing. This paper present a research made on the principle of chemicalmechanical polishing with ultrasonic vibratory silicon wafer based on ultrasonic polishingexperiments.A piezoelectric vibrator used in ultrasonic polishing was designed using ANSYS in thispaper, and also the amplitude pole of vibrator was designed and produced in this paper. It canbe measured using laser vibrometer to determine the vibration and resonant frequency of thevibrator. The parameters of amplitude pole has been changed in the process of manufacturingin order to make it better for the vibrator. In this experiments, the polishing pressure or speedwas used as a single vibration to perform the experiments, and roughness of the surface ofsilicon wafer was measuerd. the results of the experiments indicated that, Ultrasonictechnology is important in improving the quality of surface of silicon wafer.It describes the specialty of polishing pad and analyzes the formation of polishing liquidand polishing grains in it. It also simulates the process of grains in and out of the boundaryof the contact region due to the surface morphology of polishing pad.This paper present an idea that, the ultrasonic vibration may improve the of efficiency ofgrains polishing and the modal manufacturing process. It states the influence of the variablesto polishing and the results were proved experimently. The paper elaborates that theimprovement of polishing efficient grains can leave a high gloss finish. This paper provides anew method of ultrasonic manufacturing.