Preparation, Blending Modification Of A Benzimidazole Moieties-containing Polyimide Molding Powder

Polyimide(PI) are advanced polymeric materials which well-known for theirexcellent thermal, mechanical, electrical and chemical properties. PI are particularlyattractive in the microelectronics industry due to their high thermal stability (Td), highglass transition temperature (Tg), low dielectric constant, high resistivity, highbreakdown field, inertness to solvent, radiation resistance, easy processability,etc.Because of the high performance engineering polymers have excellentcomprehensive performance, in addition to meet the urgent need of the arms racewith other countries, has been widely used in the aerospace, machinery manufacturing,electronic information，in petrochemical and other fields as soon as possible. Themolding powder of PI has been used to be molded into different kinds of components.This material has good mechanical properties,heat resistance, corrosion resistance,insulation resistance, etc. Such these excellent properties drew the attention ofscientists, which can be used in mechanical, chemical, electrical, nuclear powerindustry, the spacecraft, high temperature components and printed circuit materials,etc.Polyether ether ketone (PEEK) using4,4’-Difluorobnzophenone, hydroquinoneand Potassium carbonate or Sodium carbonate as raw materials, phenol as solvent.PEEK is a kind of semi-crystalline resin, with high temperature resistance, self-lubrication, high mechanical strength and easy processing, this engineering plastics isa kind of excellent properties. Although PEEK has high decomposition temperature(about500℃or above) but due to its low glass transition temperature (143℃), whenthe temperature reached above the glass transition temperature, the modulus of theresin could be greatly reduced, which affect the properties of use. So considering thePEEK blend with PI, expecting improve the processing performance of PI, andthermal properties of PEEK, and the other properties will not be influenced very much.This article use the i-DAPBI and s-ODPA, to get a kind of polyimide, thoughthermal analysis to proves that the synthesis of polyimide resin with high glasstransition temperature (350℃), has a good thermal decomposition performance, butthe melt viscosity is higher, and not easy to processing molding. Design to make the heat performance of PI and PEEK blending, to improve the heat resistant properties ofPEEK resins. Also PEEK has good melt viscosity, easy to be molding, it also can beused to improve the properties of melt of the polyimide. Two kinds of resins blendtogether, and use the method of injecting get several different components of theblend resin as test samples. For this kind of blend resin Differential scanningcalorimetry analysis (DSC) test and (DMA), showing the compatibility of two kindsof resins, thermogravimetric analysis (TGA) shows the blending is significant.