Numerical Analysis Of Electronic Heat Management Based On Thermoelectronic Cooling Technology

As high heat flux density has become a critical problem for rapidly developinghigh-performance electronic package. At the same time, for the inherent advantages ofthermoelectric (TE) cooler, it attracts widely attention of researchers in related field. Andmany researchers expect thermoelectric cooling to be the next main electronic coolingtechnology. But as the research of electronic cooling technology based on thermoelectric,researchers usually focus on either TE performance itself or dedicating better heat sink,few researchers combine the two factors. This paper utilizes mathematical method toanalyze the main factors that heavily affect the performance of TE cooler. And use CFDsoftware build model to analyze this problem.The research was supported by National Natural Science Fund, DDSF (Grant No.51246005), Chinese Academy of Sciences (CAS) through Open Project Fund on the KeyLaboratory of Cryogenic Engineering (Grant No. CRYO201121), and Natural ScienceFoundation of Hubei Province (Grant No.2011CD13288). When analyzing the efficiencyof TE coolers, this paper use a new mathematical model replace the old one whichassumes the fixed temperature difference between TE cold and hot side. Comprehensiveinvestigation of factors in the control equation, which include current, geometrical factorand the number of TE couples, has different impact on the electronic cooling systemefficiency. After this, this paper offers an approach to get a minimum junctiontemperature and a maximum COP at the same time. This paper uses a CFD software tosimulate the entire electronic cooling system. When the junction control temperature islower than the ambient, a thermostat is necessary. And this time, the overall efficiency islow. But when the control junction temperature is higher, the efficiency is increaserapidly, the case in the paper, COP is more than2. It should be pointed out that the twoabove mentioned situations beyond the limit of ordinary heat sink method. This study shows that the electronic cooling system based on TE cooler efficiency isaffected by many parameters. In addition, the parameters themselves affect each other.This paper offers an approach to reach the minimum junction temperature and themaximum COP at the same time.