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Super Tough POSS / Epoxy Composites Preparation

Posted on:2014-01-04Degree:MasterType:Thesis
Country:ChinaCandidate:H YangFull Text:PDF
GTID:2261330398997880Subject:Polymer Chemistry and Physics
Abstract/Summary:PDF Full Text Request
Epoxy resin has been widely applied in extensive fields such as adhesives,coating, electronics encapsulation materials and airplanes and satellites due to itsfeatures of mechanical strength, electrical insulation, chemical stability and corrosionresistance. Nonetheless, high brittleness, low anti-oxidization performance, and poorheat resistance hampers its application as structure adhesives in high-end areas(aerospace, for example). Among many ways of modifying EP with a variety offillers (elastomers, plastics particles and other agents), the modification of EP usingnanoparticles has drawn considerable research interest.Polyhedral oligomeric silsequioxane (POSS), regarded as a new nano-sturcturalmaterial, is generally based on that of (RSiO1.5)n (R=Hydrogen, alkyl, aryl or anyorganic functional groups), features inorganic framework which is comprised ofSi-O-Si and surrounded by organic functional groups. This stereochemical structuregives rise to the particular property of half silicone compounds, which is one kind ofpotential polymer modifier.This paper first successfully using rotational rheometer explores the cage halfsiloxane (POSS) of epoxy resin/1,8-diamino-p-methane (MDA) curing system ofcuring the influence of the crosslinking reaction kinetics, found with get in the end ofthe EP introduced in small amounts with the curing reaction active group of POSS, EPcuring reaction activation energy, can be cut down obviously shorten gelation time,and the number, the more active group at the end of the POSS EP curing cross-linkingreaction activation energy is lower, the shorter the gelation time. Paper alsoexamines the POSS are investigated in the process of curing recrystallizationphenomenon, and characterization of the performance of POSS/EP composites,results show that the POSS can reduce the coefficient of linear thermal expansion ofEP and EP increased energy storage modulus and glass transition temperature andthermal stability. Finally, the paper from the microscopic scale of POSS/epoxy resincomposite material and the adhesive effect of aluminum alloy were studied. Studieshave shown that adding POSS in epoxy resin can significantly improve the epoxy resin wettability of aluminium alloy; As POSS end active functional groups can participatein the curing reaction of EP, improved the POSS interface bonding of epoxy resin, thusobviously improved epoxy resin on adhesive properties of aluminum alloy.
Keywords/Search Tags:POSS, MDA, Epoxy, Nanoreinforced epoxy adhesives
PDF Full Text Request
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