The Analysis Of Thermal Characteristics Of Visible Vertical-Cavity Surface-Emitting Laser

Vertical-Cavity Surface-Emitting Laser (VCSEL) with visible light wavelength have low threshold current, easy to realize two-dimensional integration, and other advantages. So VCSEL is widely used in laser display, laser communication, semicondutor pumping and other spheres.The thermal characteristic problem of visible VCSEL is always one of the important factors that affect device performance. In this paper, we performed theoretically analyzed the thermal characteristics of VCSEL from the aspects of heat generation mechanism of device, thermal conduction and analysis methods for calculating the thermal. Meanwhile, we used ANSYS belonged to the finite element analysis software to simulate of the steady-state temperature field of visible VCSEL with different packaging methods for preparing devices, respectively, encapsulated devices using In solder, AuSn solder and conductive adhesive. The theoretically calculated results showed that the method using In solder packaged device had the best thermal characteristics. And AuSn solder almost had the same performance with In solder. But the device with the method of using conductive adhesive had the poor thermal characteristics. The theoretical results provided a strong theoretical basis for our experimental preparation,In the experiment, we were used In solder, AuSn solder and conductive adhesive to prepare red VCSEL devices, respectively, and got the device which used of In solder packaging device had the best thermal characteristics, the device to achieve the optical power was2.67mW, and center wavelength was670nm.