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Network Power Distribution Based On The Miniaturization Of Microwave Multilayer Circuits

Posted on:2015-03-05Degree:MasterType:Thesis
Country:ChinaCandidate:J WangFull Text:PDF
GTID:2268330425987784Subject:Electromagnetic field and microwave technology
Abstract/Summary:PDF Full Text Request
A planar multi-way power dividing network is always large in size that hardly meets the growing demand for circuit miniaturization. For example, in L-band (1-2GHz), due to the big wavelength (150mm-300mm), it is very difficult to achieve miniaturization of the circuit, needless to say the case in the lower frequency band.This paper presents a method to design a multilayer miniaturized microwave power dividing circuit, meanwhile, the techniques of implementing miniaturization network and solutions of decoupling circuit are proposed. The design steps for the miniaturized power dividing network are summed up:(1) select the optimal network topology;(2) develop a2D circuit model and a3D full-wave electromagnetic model, and then optimize the model;(3) analyze the tolerance of optimized model.Using these methods and design steps, three novel designs of miniaturized power dividing networks are proposed:(1)2-layer power dividing network based on back-to-back microstrip line connection structure;(2)7-layer power dividing network based on mixed connection structure of microstrip line and stripline;(3)9-layer power dividing network based on lateral connection structure.Further investigations on the multi-layer power dividing networks are carried out through the following three designs:(1) in the first circuit, detailed analysis and design have been given. The experimental verifications demonstrate the validity of the simulations and reliability of the proposed techniques, indicating that the multilayer microwave power divider network can achieve both high performance and miniaturization;(2) in the second circuit, by fully considering of the existing PCB processing characteristics, detailed design and simulation are proposed;(3) in the third circuit, by reasonable using of vertical space, a novel side loading technology of resistance is proposed, which can be expected to provide useful guidance for the design of further three-dimensional miniaturized circuit.The proposed structures and design methods of multilayer microwave circuits, especially the miniaturization technologies, can provide theoretical and practical guidance for designing miniaturized microwave and radio frequency circuits with high performance and high reliability.
Keywords/Search Tags:Miniaturized power dividing network, Multilayer microwave circuit, Vertical interconnect structure, Wilkinson power divider, Miniaturized power divider
PDF Full Text Request
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