Preparation Of Nano - Copper Powder By Electrodeposition In Urea - Choline Chloride Low

Compared with large particles of metallic materials, copper nanoparticleshas a special nature of physical and chemical aspects, because of its smaller particle size, larger surface area, higher surface activity. So copper nanoparticles are widely used in national defense,electronics,bio-engineering, chemical engineering and metallurgy aspects. There are a lot method of copper nanoparticles prepared, and It can be divided into the solid phase method, the gas phase method and the liquid phase method, according to the state of the material. Buttheprocess of thepreparation of copper nanoparticles existing product particles don’t pure, production processcomplex, high energy consumption and other shortcomings, making the price of copper nanoparticles expensive,greatly limiting the application of copper nanoparticles. So it’s important to looking for a low-cost, process simple, green preparation of the copper nanoparticlesfor expanding the application of copper nanoparticles.As a new green solvents,urea-choline chloride deep eutectic solvents have a series of advantages,such as synthetic simple, inexpensive, high purity, high conductivity, high thermal stability, wide electrochemical window and so on. Usingthedeep eutectic solvents ionic liquid in the preparation of copper nanoparticles can greatly reduce production costs, simplify production processes, reduce environmental pollution, to achieve green production of copper nanoparticles preparationIn this paper, copper nanoparticles (narrowly dispersed in diameter) were prepared by constant voltage electrolysis in the molar ratio of2:1urea-Choline Chloride (ChCl) based deep eutectic solvent with Cu(I) oxide (Cu2O) as precursor. It’s sure that the electrodeposition deposit is copper powder, through the X-ray diffraction (XRD) and energy dispersive X-ray spectroscopy (EDS)analyzed. And through the design of single factor experiment, the influence of substrate temperature of electrolyte, the cell voltage and the electrodeposition time on the copper electrodeposition morphology and particle size are discussed to determining the optimum conditions for electrodeposition. Single-factor experimental conditions found that the optimal conditions for the electrodeposition:nickel cathode, the electrolyte temperature is313-333K, the cell voltage should be2.4-2.5V, the deposition timeshould be selected1-2h.Thenwe studied the electrochemical behavior of Cu(I)ionsin the deep eutectic solvents,using a variety of methods, such as electrochemical cyclic voltammetry, linear sweep voltammetry and transient time currentetc. Cyclic voltammogram ananlysis exhibited that the elelctroreduction of copper in the deep eutectic solvent was a diffusion-controlled quasi-reversible process with a diffusion of10"7cm2/s.The diffusion coefficient is lowerthan the aqueous solution, and as the temperature rises, the diffusion coefficient is rising. Linear sweep voltammetry tests showed that temperatureenhanced the kinetic reduction process of Cu(I) ions. Transient time current curve test found that the copper electrical crystallization process isa continuous mechanism of nucleation at an early stage.Finally we discussed the nucleation mechanism of copper electrodepositionin the deep eutectic solvents, analyzed the reasons of producing copper nanoparticles.