Numerical Simulation On Thermal Fluid-structure Coupling Deforemation For Microchip Plastic Encapsulation Process

Warpage deformation control in plastic encapsulation filling process is the technical key of microchip quality guarantee,the accurate prediction and precise control of microchip thermal fluid solid coupling warpage deformation is particularly important for microchip quality control.The theoretical premise of the accurate prediction and precise control for microchip thermal fluid solid coupling warpage deformation is establishing of thermal fluid solid coupling theoretical model between polymer melt and microchip surface, revealing of the formation mechanism of thermal fluid solid coupling warpage deformation,and cleaning of its key regulatory parameters.Therefore, the finite element numerical simulation virtual research platform of thermal fluid solid coupling effect and coupling deformation in microchip encapsulation filling process was established in this paper, the relevance theory among the thermal fluid solid coupling effect and coupling deformation with melt rheological parameters, process parameters and chip layout was established by numerical simulation, the formation mechanism of the thermal fluid solid coupling deformation was revealed, its key regulatory parameters were cleaned, which has laid the theoretical foundation and technical support for shape controlling technology of thermal fluid solid coupling deformationn microchip encapsulation filling process. The major achievements are as follows:The finite element numerical simulation virtual research platform was established in which thermal fluid solid coupling effect and coupling deformation in microchip encapsulation filling process can be accurately predicted and precisely controlled.Based on the established finite element numerical simulation of virtual research platform in this paper, the relevance theory among the thermal fluid solid coupling effect and coupling deformation with melt rheological parameters, process parameters and chip layout was established, the formation mechanism of the thermal fluid solid coupling deformation was revealed, its key regulatory parameters were cleaned.The microchip thermal fluid solid coupling deformation will increase with increasing of melt injection speed, melt viscosity and rheology index, and decrease with increasing of the melt injection temperature and microchip distance, It will help reduce the microchip thermal fluid solid coupling deformation that decreases melt injection speed, melt viscosity and rheology index, or increases melt injection temperature and microchip distance.The formation mechanism theory of the microchip thermal fluid solid coupling deformation was established in which the microchip thermal fluid solid coupling deformation is controlled by the thermal fluid solid coupling effect induced impact pressure field and Inhomogeneous temperature field, the thermal fluid solid coupling deformation is composed of the fluid-solid pressure field induced warpage deformation and the Inhomogeneous temperature field induced thermal deformation, and the thermal fluid solid coupling effect induced pressure field is proportional to the imbalance flow induced melt flow length difference in adjacent channels, the melt flow rate and melt viscosity, And inversely proportional to the microchip distance.