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Finite Element Simulation Analysis And Experimental Research On The Lapping/Polishing Of Quartz Crystal Plate

Posted on:2017-04-03Degree:MasterType:Thesis
Country:ChinaCandidate:M J JinFull Text:PDF
GTID:2271330482989731Subject:Mechanical Manufacturing and Automation
Abstract/Summary:PDF Full Text Request
Quartz crystal is the largest used crystal in the world. It is highly used in digit circuit, computers, information communication and sensor. Quartz crystal surface quality is mainly determined by its frequency stability, temperature-frequency characteristics and power consumption. In order to ensure its usability, we need to use effective process method to increase its surface quality. Quartz crystal belongs to the hard brittle material. Quartz crystal has characteristics of high hardness, good abrasion resistance, outstanding corrosion resistance and oxidation resistance. There characteristics make quartz crystal hard to be processed into flat surface, which has high surface quality, by traditional processing method. Lapping and polishing play an important role in processing quartz crystal, so how to use these to get high surface quality quartz crystal become an important topic during these years.Based on analysis of worldwide experiment and research, this article is talking about using Chemical Mechanical Polishing to perform a high quality planarization processing on the quartz crystal plate’s surface, and eventually to increase its surface quality and decrease surface roughness.This article is talking about using ABAQUS software to analyze removing process of single abrasive in lapping process. By analyzing data that changed by lapping depth, the friction coefficient between the abrasive and quartz crystal plate, abrasive size and shape, this article investigates how those changes affect work piece surface, material remove quantity and residual stress.Combining finite element analysis, with process parameters from changing lapping pressure, lapping speed, lapping time, abrasive size, polishing pressure, polishing speed, polishing time and slurry flow during Lapping and Polishing process experiment, this article deeply investigates how those factors affect material removal rate and surface roughness of quartz crystal plate and comes up with process parameters optimization plan. Based on using optimized process parameters, it is possible to machine quartz crystal plate which has Ra275 nm surface roughness into new quartz crystal plate which has Ra9 nm surface roughness. It highly increases surface quality of quartz crystal.
Keywords/Search Tags:Quartz crystal plate, Chemical Mechanical Polishing, Process parameters, Finite element simulation analysis, Planarization processing
PDF Full Text Request
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