Study On Surface-Reconstruction-Based Nanosctrach Techniques

Micro/Nano manufacturing technology is a hot issue in the current research. With the rapid development of nanotechnology, MEMS/NEMS, the micro structure, parts and related products are more and more widely used in military and civil fields. Nanoscratch as a new processing technology, shows a very strong processing flexibility in micro/nano manufacturing field.First, in this study, according to the process of nanoscratch on monocrystalline silicon, author established simulation model in the molecular dynamics software. By changing the parameters of nanoscratch processing of silicon material, the reconstruction phenomena and mechanism of the surface atoms of monocrystalline silicon in the nanoscratch were studied. The phenomena include the phase transition, plastic flow, the silicon atoms relaxation, and so forth.In this study, to verify the simulation research main conclusion, experimental study on the mechanism score of monocrystalline silicon is carried out. In the experiment, the indent and scratch process of monocrystalline silicon material is studied, including amount of elastic-plastic deformation, elastic deformation recovery and brittle fracture in scratch groove to reveal the mechanism of deformation and material removal during nano scratching.In this study, the nanoscratching processes of monocrystalline silicon were researched. By using experimental method, nano indentation depth prediction model was established and the elastic recovery and the proportion of the plastic deformation were analyzed quantitatively. Scratch force, scratch rate and scratch number were optimized. The influence of scratch number on cross-section shape of groove was researched.This study has a certain theoretical and application significance because it provides theoretical and experimental basis to optimize nanoscratch processing technology and analyze the stability of the micro-nano structure size shape and the evaluation of processing quality.