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Mechanism And Experiment Research On Grinding Area Boundary Division Of Single Layer Electroplated CBN Grinding Wheel

Posted on:2017-01-20Degree:MasterType:Thesis
Country:ChinaCandidate:G LiFull Text:PDF
GTID:2271330503457341Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
The technology of creep feed grinding narrow-deep-groove with electroplated single layer CBN grinding wheel offsets the deficiency of conventional processing method such as cumbersome process, low processing efficiency, high production cost and so on. The grinding area boundary division theory of electroplated single layer CBN grinding wheel has an important role on the accurate positioning of high-quality profile surface. This paper studied the distinguish edge boundary theory between top and profile area for electroplated single layer CBN grinding wheel through the location of profile-surface quality boundary line on narrow-deep-groove. The effect of grinding parameters(rotation speed of grinding wheel, feed rate and grinding depth) of boundary line location and grinded surface quality were studied, which provide theoretical foundation for improving the product quality and the application of narrow-deep-groove structure parts and creep feed grinding narrow-deep-groove technology. The main research contents are as follows:(1) In order to solve the problem of the location of profile-surface quality boundary line on narrow-deep-groove, the grinding area boundary division theory of single layer CBN grinding wheel was studied. The effect rule of grinding parameters for boundary line location was studied with experiments conducted in the process of narrow-deep-groove grinding. Experiment results showed that the distance between the boundary location and the bottom of groove decreased with the increase of rotation speed and grinding depth. But the distance would decrease and then increase with the feed rate going up.(2) Based on ANSYS software, the results were obtained such as the effects of grinding wheel fillet radius, grinding wheel thickness and normal grinding force on boundary line location. The narrow-deep-groove stress filed was obtained. The simulation results showed that the boundary line location will be far away from the bottom of narrow-deep-groove with the increase of grinding wheel fillet radius, grinding wheel thickness and normal grinding force of grinding wheel. The simulation and experiment results were compared, and the accuracy of simulation results was testified.(3) The grinded surface topography, roughness and sub-surface were detected, and the sub-surface structure integrity of narrow-deep-groove grinding surface was researched. Experiment results showed that increasing the grinding wheel rotation speed and reducing the grinding depth will help to reduce the depth of grinding surface groove marks and the grinding surface roughness. With the increase of feed rate, the roughness value increases, but the grinding surface topography has little change. The cutting process of grains causes plastic deformation of grinding surface and lattice dislocation, which cause the lattice refining into tiny sub-grain. The lattices spacing become larger.
Keywords/Search Tags:electroplated single layer CBN grinding wheel, grinding area, boundary line, narrow-deep-groove grinding, surface micro topography
PDF Full Text Request
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