The Stability And Durability Of The New Rich Water Thermal Semiconductor Material

High-altitude Qinghai-Tibet Plateau permafrost areas of geotechnical engineering arefaced with the problem of high temperatures, ice-rich permafrost and the global warming.The artificial thermal disturbance of engineering construction will lead the underlyingpermafrost to thaw settlement, especially for black pavement of highway in the future. Suchworks increased the difficulty of maintaining the permafrost zone long-term safety, as wellas the ensuing disease management issues. Based on our group’s previous study about RichWater Thermal Semiconductor Material, this paper developed a new efficient, convenientconstruction, economical and environmentally friendly thermal semiconductor materials,which can be used either in the newly built subgrade or exiting subgrade for treatment.Based on the change of water and ice thermal conductivity, the prepared rich water material,whose mesh structure can consolidate a lot of free water in a short time after hydrationreaction, the thermal conductivity ratio under freezing and thawing condition is more than2.9, and can form higher strength.This paper mainly through laboratory experiments, choice sulfur cement clinker as thebase material, natural anhydrite and lime as accessories, consider a variety of additivesaffect both the complexity and the role of the mixing process by orthogonal optimizationfinalize new pulping process rich hydrothermal semiconductor materials are: base slurryand slurry materials were mixed by stirring5min pouring; distribution ratio in the range ofeach group: the sulfur cement clinker as the base material, and retarder R1,R2(0.4%~0.6%, and the mass ratio of the base material, the same below), bentonite binder (2%to4%), natural anhydrite (40%~60%), lime (15%~25%), lithium hydroxide (2%to4%),coagulant C (2%~4%), excipients bentonite (5%to7%). Get the properties of the NewThermal Semiconductor Materials as follows:(1) When the water cement of rich water material are2.0,2.5,3.0, the water content ismore than140%, the thermal conductivity ratio under freezing and thawing condition ismore than2.9, the compressive strength of28days is more than1.7MPa, the heave rate andthe permeability coefficient are respectively less than3.9%and9.6E-6cm/s.(2) Through25freeze-melt cycles testing of the New Rich Water ThermalSemiconductor Material, it is concluded that water cement ratio2.0,2.5, and3.0samples ofwater retention ratio and compressive strength were above97%and1.3MPa, the strength ofsample with water cement ratio2.0up to2.94MPa. After the material repeated freezing andthawing experiment, the water retention ratio remains a high-level, and with an excellent property of thermal semiconductor, the compressive strength remained above80%of thepeak intensity, the New Rich Water Thermal Semiconductor Material has good resistance tofreezing and thawing.(3) This paper uses the recrystallization property of the material, while withoutchanging the property of thermal semiconductor, determined the preloading load of materialis80%of the peak intensity at the corresponding period, make the sample with three kindsof water-cement ratio preloading after been maintained3days, its subsequent strength isincreased, the strength of water cement ratio3.0sample can be increased by nearly10%,the larger water-cement ratio and preload sooner, the subsequent strength get a greatergrowth. Therefore, if the recrystallization property of material could be used rationallywhen engineering applications, can be improve the compressive strength of the materialeffectively, and strengthen the mechanical stability of the project.Comprehensive test results, the New Thermal Semiconductor Materials has awater-rich, high fever semiconductor resistance, high strength, low heave and hypotonicfive properties and has good resistance to freezing and thawing, it is an ideal forgeotechnical permafrost zone thermal semiconductor slurry material.