Research On The Diamond Wire Saw Silicon Wafers Manufactured By Mortar Equipment Modified

Along with the development of solar cell technology, laboratory monocrystalline silicon solar cells conversion efficiency progress is obvious, but in the industrial production of monocrystalline silicon solar cell conversion efficiency is not so well. In order to adapt to the large-scale industrial production, people change the silicon wafer cutting way, using diamond wire cutting silicon wafer, but the diamond wire saw equipment is so expensive, and the cutting surface stress is larger, debris is serious, the traditional textured technology and solar cell conversion efficiency effect are not good. This paper is suitable for large-scale industrial production equipment modification, put forward relevant production process parameters, and research on the diamond wire saw wafers.Reform the traditional mortar cutting equipment and adjust production technology, using the monocrystalline silicon slice by resin diamond wire produce, comparing with the diamond wire saw special equipment produce the silicon wafer, the result shows that the average thickness, TTV, debris rate of silicon produced by the PV800H equipment have more advantages over the PV500. At the same time comparing with the traditional mortar monocrystalline silicon surface topography characteristics, surface damage layer, it is concluded that diamond cutting silicon slice surface have saw mark, and mortar cutting silicon slice surface have no obvious saw mark, under the observation of scanning electron microscope (SEM), diamond cutting silicon slice surface damage is smaller than mortar cutting silicon slice minimum damage layer 7 microns, and because the diamond cutting silicon slice surface have relatively smooth area, it is concluded that in the visible light diamond cutting silicon wafers reflectivity higher than mortar.Because the diamond cutting silicon wafer surface damage is smaller, and in the process of texturization etching is very difficult. Using the traditional textured technology of diamond cutting silicon wafers could not form a better surface pyramid structure, and the reflectivity is higher than mortar cutting wafers. We optimize the textured technology of diamond cutting silicon wafers, and test the reflectivity and pyramid surface morphology, get the optimal process program,the results show that diamond cutting silicon wafer reflectivity is less than the mortar cutting silicon. Compares respectively the electric performance of diamond cutting silicon wafers and mortar cutting silicon wafers, it is concluded that diamond cutting solar cells are improving slightly in open circuit voltage and short circuit current, finally the diamond cutting solar cells conversion efficiency is higher than mortar cutting solar cells 0.17%.