Gold Ball Bonding Technology Influencing Factors Analysis And Modeling

With the fast development of MEMS and microelectronic technique, wire bondingresearch turns to fine pitch, precise quantitative control and unconventional bonding. So,regular process can’t satisfy the developing need. People never stop the study of wirebonding technology. Wire bonding technology has been developed for many years. Butthere are many technology factors that affect bonding quality. Besides, mechanism of the1st and the2nd bonding is different. Therefore, research on wire bonding is necessary.The paper proposes a new bond energy model, bond energy equals to the heat energyproduced by heater and the friction energy. Bonding is essentially plastic deformationbetween interfaces under the coupling action of heat, force and ultrasonic. As temperatureincrease, the metal atoms movement speeds up. Under the action of micro sliding wear,solid phase connection forms between clean metal surfaces. According to the analysis ofenergy transfer during bind process, do single factor experiment on balling parameters,bonding time, bonding pressure and ultrasonic energy. It can quantitative detect the effecton bonding quality under different parameters. Fit the experimental results.Based on theresults of single factor experiments, we can choose appropriate factors and levels to doorthogonal experiments. The experiment results show that the main factor affecting thefirst bonding quality is ultrasound. Bonding pressure affects the second bonding pointquality mostly. At last, adopt non-linear regression method to set up wire bonding processparameters model.The result is helpful to choose reasonable parameters setting to achieve betterbonding quality. It can implement bonding quality prediction. This paper provides the basisfor subsequent product design and improvement.