Design Of Chip Pick-and-place Manipulator In High Density Packaging Process

Nowdays the development of IC packaging industry is rapid. More and more high-densitychips are put into use. So it is imminent to study for high-density chip packaging process.This paper studies for chip pick-and-place manipulator in high-density flip-chip bondingprocess, focusing on its design, kinematics modeling and analysis, error modeling andanalysis, parameters calibration and validation and so on.Firstly, make it clear about the requirements of the process, do principle design of themanipulator. The flip-chip bonding technology which is based on ACA (anisotropicconductive adhesive), includes dispensing, correcting posture, placement and other process.The chip pick-and-place manipulator is mainly responsible for the leveling function incorrecting posture position procedure. Based on the analysis and synthesis of the levelingmechanism, the leveling mechanism is designed as the rotational decoupled parallelmechanism of two DOF. After precision calculations and strength analysis, themanipulator’s model is designed which contains bonding head and other components.Secondly, the kinematics modeling of the manipulator is established by using thegeometric method. Based on the kinematics model of leveling mechanism, the mathematicalmodel of chip angle adjustment device is established, completing the direct correspondencebetween the chip angle adjustment quantity and the input of the leveling mechanism, which isconvenient to controlling. Then the error modeling of the linkages in leveling mechanism isestablished based on the perturbation method, and the sensitivity of the output angle for theerror of rod length is analyzed, revealing the effect of processing and assembly error to theprecision of leveling mechanism.At last, calibrate the kinematics parameters of the manipulator. Combining manipulatorkinematics model and error model, measuring the manipulator’s leveling accuracy byexperiment, the manipulator’s kinematics parameters can be calibrated after that. The chippick-and-place manipulator’s leveling accuracy is improved when substituting the designedparameters with identification parameters, which makes it meet the design specifications.