Wire Bond Reliability Improvement Research Of Semiconductor

In our current economic development, semiconductor packaging industry plays a more and more important role. For non pin flat package (Quad Flat No-lead package) is an advanced form of semiconductor package.Gold wire bonding process is the most important in semiconductor technology. It connected with the internal chip and external frame. Each of gold wire bonding must be correctly connected to the chip, any fault will cause quality issues and reduce product efficiency. The price of gold is increasing higher, improve the product efficiency, reduce the company cost, increase the economic efficiency of enterprises. This paper will improve the wire bond of QFN small size package of products, first bonding point reliability, to reduce the equipment standby time, improve production efficiency.This paper contains the following contents:1、Analysis of the production process, wire bonding principle, study on the effect of the first bond factors. Setting and do comparison experiment on EFO ignition rod, to ensure that in the current6000is made of spherical high yield and stable, ensure the stability of the gold wire bonding.Select the appropriate capillary mode, to ensure that the quality of bonding.2、To use pull thrust device ROYCE580and SEM(Scanning electron microscope scanning electron microscope),observe and analyze the reasons of the first point. The data measured by tensile tester, obtains the CPK below1.67, need to improve. The analysis and conclusions of technological parameters of Ball Power, an important Ball force ball Time, adjust and optimize.3、To do DOE (design of experience)experiment design to the bonding parameters were optimized and validated,get the Base Force=35,Base Time=10,Base Power=51,and the analysis of data used in actual production, the first point to obtain optimized parameter bonded non stick0.061%yield far less than previous1.686%.4Through the Precon test, TCT test, PCT test to further confirm the reliability of the optimized products. Through the research of QFN small package0.8mil wire bonding process principle, to find the effect of wire bonding bad reasons, and optimize the parameter on this basis. And transfer the optimized results to engineering practice promotion, improve production efficiency, reduce the operation cost, and increase economic efficiency.