Study On The Development Of Ag-Based Pastes For Flexible Film Curable At Low Temperature

Low-temperature dryable Ag-based pastes for flexible film were the important materials to make conductive line of membrane switch and keyboard, RFID. EL. touch pannel, etc. Firstly, the experimental methods and testing standard were established, and then the effect of Ag or Ag/Cu powder, bridging agents, solvents&diluents, additives on the conductive properties and the critical line mechanical properties of flexible circud was studied, meanwile the suitable curing conditions of polymer film substrate were also discussed.Flake powder of Ag or Ag/Cu is suitable for making Ag-based pastes used flexible film substrate because the flake shape is easy to form sheet laminate structure in the printing process, which is good for keeping the contact area of Ag powder enough even if the particles could be forced a certain displacement in the bending process,. and the flake grain was of bendable advantage. For lmm,wide printed circuit fine, the silver particle size should be5-8μm, but for different requirements of the paste the silver particle size and the amount need to be considered. for example, the80μm wide fine line in touch panel, the smaller silver particle size and the larger amount of silver should be considered. Poly(vinyl chloride/vinyl acetate) resins and polyester resins can be compounded together as the excellent bridging agent. If the content and the type of the silver and the solvent type was constant, the comprehensive performance of the paste should be the best under the addition 01po叭.lnj l chlorld叭叭l acetate)resin A in3.1％(w1).polyester resi’n V220&V300total amount i117.28％(w1)and Ihe mass rati’o of0.75.The so№l心and eVaporation rate of s0}Vent can affec[111e performance of[he pasfe.under the addiII’On0f p0M.In.l chIoridc／Y吣l acetate)resi’n A in3.1％(wI),polyester resi’n V220&V300total amount i11690／0(.VI),f]ake Ag in50％(wc),CAC(boiling poinl l56.3℃)and dimet’h叫succl’nate (boilin掣poinl200℃)cotal addi.t-’on1evel0f40％(w1)as solvent diluent.added wifh a1a掣r11ropori s.on0f dimet’h Vl sUCcl’nate.1he formulaIed conducIiVe pasf印uid prope啊was better and more suilfable in line wi.th posI-processl’ng.F0r matenal dispersl’orl and screen prinfabⅢb’requl’rements.fumed silica was used for pasfe fhickenl’ng.fhe amount of fume,d silica0ptl’mum mass fraCtl’On was in0.3％.1.0％.The effecl of dD’jng temperature,dD’ing ti’me.grinding On low-temperature dD’able Ag-based pastes for neXl.Ole nlm was scudied Connrmed[he Ihe necessl’fy0f鲥nding and dispersi’n芒.1he optl’mum heal-d吖ing ternperature range is l30-l40℃.and Ihe岍ing ti’me is preferablj about50一一60111111al l30℃...