| The development of science and technology, in some degree, promote thecontinuous upgrading of electronic products, and micro-electronic packagetechnology play a more and more important role in the electronics industry. Thedevelopment of BGA package technology will help to solve the electronic deviceminiaturization, energy saving and other issues greatly. The solder joint wastaken as the key position in the study on BGA package technology, its valueincludes the support of physics, thermal conductivity and signal transduction. Itsreliability determines the stability and lifetime of electronic products. The shearexperiment, for solder joints, was usually used to evaluate the binding strengthbetween solder and substrate, and provides some reference basis for the researchon the reliability of the solder joints.This paper study the shear mechanical behavior of SAC305/Cu solder jointsby the finite element simulation and experiment analysis, the stress and straincurve of SAC305/Cu solder joint was analyzed by finite element simulationsoftware under different shear rate, the analysis results show that with theincreasing of the shear rate, the capacity of resistance to shear of solder jointsincreases, so did the shear strength of the solder joints. And shear experimentwas taken under different shear rate to SAC305/Cu solder joints, the resultindicate that the experimental and the finite element analysis method results wasbroadly consistent. In addition, the finite element simulation and experimentalanalysis was taken under different shear height to SAC305/Cu solder joint, theresult shows that the capacity of resistance to shear of SAC305/Cu solder jointdecreased with the increase of the shear height the solder joint, and the data offinite element simulation and experiment coincide generally. The analysis wasalso taken under different diameter of SAC305/Cu solder joint by finite elementsimulation and experiment, the analysis result shows that the solder joints exist "size effect" in some degree, the shear strength of solder is connected with thediameter of the solder joint, the shear strength of the solder joint will decreasewith the increase of diameter of solder joint. The finite element simulation wastaken to analyze the situation of SAC305/Cu solder joint under the differentthickness of IMC layer, the results of the analysis indicate that there is a greateffect of IMC layer on the shear mechanical properties of solder joint, the biggerIMC layer thickness is, the lower shear capacity of the solder joint is. So did theshear strength of the solder joint.This paper take the shear experiment and analysis on SAC305/Cu andSAC0307/Cu, and obtained the conclude that the shear capacity of the solderjoint increased gradually with the increase of shear rate. The shear strength ofSAC305/Cu solder joint performance is better than the SAC0307/Cu’s.Comparing under different shear heights, the study finds that shear strength ofSAC305/Cu solder joint is better than SAC0307/Cu’s. Taking the analysis ofshear strength under different diameter and the increase tendency of IMC afteraging of solder joint, the result reflect that the comprehensive mechanical ofSAC305/Cu solder joint gets better than SAC0307/Cu’s. |
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