Research On The Cooling System Of Laser Based On Micro Thermoelectric Cooling

The cooling problem of the semiconductor laser has become the bottleneck which isrestricting its development. Compared with other cooling methods has many advantages,simple structure, small size and easy to integrated with the laser package. In this paper,the thermoelectric cooler (TEC) was used to solve the cooling problem with high heatflux of2.5104W/m2.By optimizing the cooling method of the thermoelectric coolinghot side to maintain the working temperature in available range30℃-40℃, even the laserworking in the environment with high temperature of60℃.In this thesis, the method of finite element analysis combined with experimentalverification was used to analyze the thermal dynamics changes. Firstly the TEC wasselected, then the parameters of the model in the finite element analysis were set, finallythe analysis was done. An alternative heat source was used as the heat load, and theexperimental bench was built by using the selected TEC.The mainly content of the study is optimizing the cooling method of thethermoelectric cooling system, consist of three ways: there no cooling system on TEC hotside, there is free convection cooling system on TEC hot side and there is forcedconvection cooling system on TEC hot side. The different effects of these three wayscooling system on the TEC cooling ability were considered. The experiment verified theaccuracy of the simulation analysis result, then the comparison and the error was given.In order to study the working performance of the TEC, the effects of the ambienttemperature, the thermal resistance of the cooling system on hot side and the enclosure ofthe laser were considered.The results showed that the T can’t work well if there was no cooling methodadded on TEC hot side. The heat sink should be added to the hot side of the TEC, tomaintain the cooling ability of the TEC. The cooling system which was added heat sink and fan on TEC hot side can maintain the required of the design. The finite elementanalysis indicates that the temperature of the TEC cold side and hot side, the temperaturedifference of the two sides’ temperatures will increase with the increase of the ambienttemperature, while the COP of the TEC will decrease with the increasing of the ambienttemperature. The increase of the thermal resistance between the environment and theTEC hot side will weaken the cooling ability and COP of the TEC. At the last, themaximum thermal resistance on the hot side is1.55K/W.