Research And Realization Of Planting Technogoly On Ultra-thin IC Card

The fast development of national railway transportation brings continuous demand on intelligent IC cards and applications. In 2014, Shenzhen Metro transport 2.84 million people daily. Nowadays all the ultra-thin IC card(thickness 0.48-0.52 mm) being used at Beijing, Shanghai and Hangzhou are produced by etching antenna technology, which in usage encounters high fail rate of misconnection, and the average service life is only 3 years. Among the 3 cities, first generation subway ultra-thin IC card in Beijing was fabricated by using adhesive and laminating technology, after many times fold, the card can directly strip into 2 slices, the average service life is about 1.5 years; After the improvement to press a craft for whole layer, the easily tear apart issue was solved, but the inlay technology(the chip bonding in the inlay), expiration after folding many times is still a problem(the chip didn’t got well protection and caused chip’s easily separate with engraving antenna; The chip breaks etc.). But along with the continuous development of reduce thin chip and improving of super voice wave planting technology, the ultra-thin IC card to be produced by super voice wave planting technology becomes possible.This thesis is using above precept, which effectively solve the lose efficacy issue on inlay technology apply in the ultra-thin IC card, significantly reduce the cost for high failure rate and reuse. The problem faced: Currently the thickness of IC cards being produced by super voice wave sunk cord technology on the market is above 0.6 mm, how to overcome existing planting technology to make to achieve 0.48-0.52 mm thickness? The selected design breakdown the problem into 3 points and solve them one by one:1.Control the COB(chip on board) total thickness within 0.31 mm. Review the structure of COB, list down the features and parameters of each part, combine with SOP and special request of every process, control incoming PCB base material thickness, anticipate the important point rules in production process, in-process supervision to solve COB thickness problem.2.Because the COB dozen whets too thin and is subjected to high pressure existence expiration risk. How to control the failure rate of medium material layer process? With the understand and study on principle of lamination plant, die bonder and wedge bonder, combine with all the factors that easily cause COB expiration, then check them one by one. Select Reduce thin chip, cut over thinner nation to settle aluminum line and adjust the working parameter of welding machine to control aluminum line angle, thickness confirmation and control of whetting process, analysis and confirmation of slice material selection that match parameter of the layer to ensure that the problem gets effective control.3.Find out the best antenna position and parameter setting. Through the formula between IC card frequency requirements and capacitance / inductance, combine chip capacitance value, to compute antenna inductance amount. Combined with the experience and experimental data, to determine the antenna location in the IC card.