Research On Failure And Lifetime Prediction For IGBT Power Module

Insulated gate bipolar transistor as the power switch device, a current-carrying density, low saturation voltage, and many other advantages, has been widely used in new energy power generation, transmission, and many other key areas. IGBT power modules, a bad working environment, leading to fatigue caused by aging, such as current intensity, work during the switching frequency is very high, which brings to the reliability of the device. Through long-term study and working experience, about 55% of the failure reason is because the device work at the time of the voltage, current, the rise of junction temperature indirectly speed up the process of aging degree module, if the junction temperature reaches a certain height, the fatigue of the device can present the upward trend in geometry, failure to accelerate. So the IGBT junction temperature of power module and its longevity, is closely related to the reliability of the system.First of all, this paper briefly introduces the basic structure and operation principle of IGBT power module, detailed summary and analysis of failure causes and failure forms, IGBT power module will failure causes into two categories, the physical and electrical.Secondly, according to the principle of junction temperature measurement, fully absorb the existing model IGBT power module electric model, this model can reflect the device power loss and the relationship between the junction temperature rise. This paper discusses how to establish the IGBT power module electric heat simulation model and simulation model.Again, based on MATLAB/Simulink software, set up IGBT power module of electric heat simulation model, simulation model, simulation module when the actual work of electric coupling process, the current.Finally, by analyzing the research shows that the IGBT power module has close relation with the life and junction temperature of junction temperature can be assumed to be variable prediction module of life, the life prediction mathematical model for the life of the module under normal working condition.