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Research On Manufacturing Technology Of Ceramic Element With Base Metal Electrode Based On Print Full Electornic Technology

Posted on:2017-01-31Degree:MasterType:Thesis
Country:ChinaCandidate:Q XiongFull Text:PDF
GTID:2308330485986512Subject:Electronic materials and components
Abstract/Summary:PDF Full Text Request
Ceramic element has the advantages of high temperature resistance, corrosion resistance, and excellent electrical, magnetic properties, which is widely used in the area of electronic industry. The surface metallization which leads to the electrode preparation is related to the electrical properties and stability of ceramic elements. Therefore, it is one of the key technologies in the fabrication of ceramic elements. There are many kinds of preparation methods of the ceramic element electrode, which mainly include direct bonded copper, burning seepage, spray and physical vapor deposition. Because of the deficiencies of most of these methods, such as complex production process, wasting of precious metal and high cost, this paper will put forward the coating technology of ceramic element with base metal electrode on the basis of print full electronic technology, and then study the engineering applications of this technology. The specific contents are as follows:(1)We research the formation technology of ceramic element with base metal electrode based on print full electronic technology. Firstly, we optimize the cleaning, degreasing and roughening treatment programs of ceramic substrate through experiments. Secondly, we use a new technology to make triggering layer, which is simple, has a well-activating effect and can be applied to the preparation of industrial production. The principle of this technology includes digital inkjet printing ink on ceramic substrate and patterning process to form triggering layer. We also optimize the ink component system of the triggering layer. Thirdly, we optimize the formations of electroless copper plating solution which is based on formaldehyde as reductant in electroless copper plating system. And we succeed in the process for preparing base metal electrode of ceramic element on the basis of print full electronic technology.(2)We study the production conditions of engineering technology by numerical simulation. The drum of engineering equipment is geometric modeled through using Gambit software. 2-D and 3-D numerical simulation of the solid-liquid two phase flow within the drum is made by using fluid dynamics FLUENT software. The roller speed and the volume ratio of ceramic substrate with the zirconium ball are set to the boundary and initial conditions of FLUENT. Through observing the solid particles distribution inside the drum under different circumstances, we can select the optimum production conditions: the speed of drum rotation is 40 rpm and the volume ratio of ceramic substrate and the zirconium ball is 1:2.(3)Batch experiments are made on the basis of combining print full electronic technology and production conditions of engineering technology obtained by numerical simulation. Through the sampling analysis of ceramic element after plating base metal electrode, we can verify the validity of the numerical simulation results and the feasibility of engineering technology of making ceramic element electrode by plating base metals based on print full electronic technology.
Keywords/Search Tags:print full electronic technology, trigger layer preparation technology, numerical simulation, engineering technology
PDF Full Text Request
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