Research On Preparation Process Of The Polymer Matrix Thermal Conductivity Composites For The Cooling Board

With the rapid development of electronic integration and assembly, more and more heat is generated in the power element, so the demand for polymer-based thermal conductivity composites is also expanding. In this paper, we take the polymer-based thermal conductivity composites used in the electronic components board as the subject, which are prepared by melt-extrusion. The paper studied the preparation process of the composites used for thermal invention board, made out those applicable to electronic components and designed the reasonable structure of an electronic components cooling board. Ansys finite element analysis software had been used to simulate the cooling path of the board so that the polymer-based thermal conductivity composites may take place of the traditional board. This paper listed out the suitable material and provided a reasonable structural design for the board with the hope of putting it into practical use. Here are the efforts that have been mainly made:1. The correction model of the thermal conductivity. This paper deduced the thermal model suitable for high filler content of polymer matrix composites, which is based on Maxcell model, Bruggeman model and Fricke equation. By gradually increasing the amount of filling particles, differentiating and then integrating the Maxcell equation, a new model of the thermal conduction equation having considered both the particle shape and the interface thermal resistance has been deduced.2. The surface modification treatment process of the thermal conductive fillers. This paper made the modification on the surface of magnesium oxide (MgO) with the silane coupling agent and then used infrared spectroscopy and scanning electron microscope(SEM) to characterize the effects of modification. By comparison, it turned out that the silane coupling agent made the best modification on the surface of MgO. We made the modification on the surface of carbon fiber (CF) using the acidification method and used scanning electron microscope(SEM) to characterize the effects of modification.3. The preparation process of the polymer matrix thermal conductivity composites. By melting blending, this paper prepared polymer matrix thermal conductivity composites with SJ-35 twin-screw extruder and granulating machine, then tested the polymer matrix thermal conductivity composites in terms of thermal properties, mechanical properties. In addition, the morphology characterization of the composites was also conducted through SEM. Based on the experimental data, the properties of the polymer matrix thermal conductivity composites were analyzed from three aspects:filling quantity, packing type, proportion. Using the revised model of the thermal conductivity, the theoretical value of the thermal model was calculated, which was then compared with the experimental value.4. The structural design and finite elemental analysis of the board. Based on the first law of thermodynamics, the heat transfer control equation was derived, for which the initial and boundary conditions for the application of the equation was also provided. Fin structure was designed on the cooling board to improve the cooling efficiency as well as increase the cooling area. The surface heat transfer coefficient, heat flux, fin efficiency, thermal resistance of thermal conductivity and heat flow could be obtained. The Pro/e board model was then converted into Ansys to make the simulation analysis of thermal conductivity.