Simulation Analysis On Effect Of Workpiece Temperature With Nanometric Cutting Single Crystalline Copper

Nanoscale machining technology is one of the key technologies in the field of ultra-precision machining, it could obtain the component which has high precision and high surface quality. In the process of nanoscale machining experiment, it is different to dynamically observe and control the particle motion state and defect evolution due to the removal amount of the material only in the range of dozens of nano. In the research field of nanoscale machining simulation, the researchers on the world mainly concern to the effects of crystal orientation?machining parameters and tool geometry for material deformation law and removal mechanism in the process of nanoscale machining, but the influence factors and the influence law of workpiece temperature is rarely researched, the workpiece temperature plays a key role in improving the machining accuracy and surface quality. In view of the above problems, this paper carries out research on nanoscale machining single crystalline copper by using molecular dynamics simulation method, and analyses the influence factors and influence law of workpiece temperature. The main research contents include the following parts:Firstly, establishing the simulation environment of molecular dynamics, compiling the simulation program of model which comprises the fixed layer?thermostat layer and newton layer of single crystalline copper nanoscale cutting and the program of model which comprises rake angle?clearance angle and tool nose radius of diamond tool based on lammps language. Choosing the appropriate potential energy function according to the machining object, choosing the corresponding ensemble according to the real machining environment, in order to reduce the size effect in molecular dynamics simulation, imposing period boundary condition on the simulation model.Secondly, analysing the remove process of material?the process of surface production and the variation of system temperature and potential energy in the process of relaxation. Setting different crystal orientation?cutting velocity?cutting depth?tool rake angle and nose radius in the program and using the visualization software of atomeye to analysis the influence law of workpiece temperature from the aspect of cutting force?chip deformation and dislocation movement in the process of nanoscale machining.Finally, comparing the influence law of workpiece temperature with pore structure and without pore structure in nanoscale machining, setting different pore structure number and size in the program, analysing the influence law of pore structure number and size for workpiece temperature from the aspect of cutting force and dislocation movement in the process of nanoscale machining.It could be found that crystal orientation has some certain effect for the workpiece temperature; the bigger of cutting velocity?cutting depth?negative rake angle and tool nose radius, the higher of workpiece average temperature; the bigger of positive rake angle and the number and size of pore structure, the lower of workpiece average temperature; the results of this research have certain theoretical guiding significance for understanding the influence law of workpiece temperature in nanometric cutting process.