Preparation And Application Of Phenolic Foam Insulation Material

Traditional building thermal insulation materials,such as polyurethane foam,polyethylene foma have good insulation properties and light mass.But they have a fatal flaw: flammable,and combustion will produce large amounts of toxic and harmful gases,resulting in grave losses of life and property.Phenolic foam is a new type of building thermal insulation materials.Compared with these traditional building thermal insulation materials,it not only has good thermal insulation properties and light weight,but also it's biggest advantages is that flame retardant,low toxicity and low smoke.At present the preparation of phenolic foam are mainly using a high-temperature hot mold process.And it is not suitable for construction on site.Researching and developing a kind of phenolic foam which can foam at a low temperature will greatly save manpower and material resources greatly.So the research has theoretical significance and practical application value.In this thesis,the phenolic resin was synthesized by fomaldehyde and phenolic.Using the phenolic resin,surfactant,curing agent and vesicant as the raw materials to prepare the phenolic resin foam at the room temperature.In order to optimize the process of the phenolic resin sythesis,several methods and different synthesis conditions have been compared and discussed.The viscosity and the gelation time were tested by the methods respectively.The results showed that when the F/P was 1.7,the amount of catalyst was 4wt%,the reaction temperature was 85? and the reaction time was 90 min,we can obtain the phenolic resin which can foam at room temperature and the viscosity was 5000~8000cp,the solid content was 80%~85%,the gelation time was about 60 s.The storage life of the resin was 30 days at 25?.In the process of the preparation of phenolic foam,the content of surfactant B,foaming agent C and curing agent were studied and discussed.The optimum conditions: the phenolic resin was 100 g,the surfactan B was 4~6g,the foaming agent C was 10~12g,the curing agent was 4g;The foaming temperature was at 20~30 and the foaming time was about 10m? in.The properties of foam were tested and the results as follow: the apparent density was 40~60kg/m3;the compressive strength was about120~180kPa;the oxygen index was 34%~41%;the thermal conductivity was 0.032~0.04;the volatile water absorption was 3.5~6.It meets the requirment of the GB.The non-isothermal kinetics of the phenolic resin was systematically investigated by DSC.The curing kinetics equation was obtained.The curing reaction mechanism was researched and the result showed that the curing reaction transits from chemical-controlled to diffusion-controlled.The kinetics of the phenolic foam and the thermal decomposition mechanism was studied by TGA;the result showed that the thermal decomposition reaction of the phenolic foam was chemical-controlled with different reaction order at different reaction stages.