Research On Continuous Removal Of Lead In MSA Tin Plating Solution

Nowadays,tinplate is widely used in food and beverage packaging.The excessive amounts of lead in tinplate coating will affect people's health.Due to the presence of lead in the raw material,lead and tin have very close electrode potential from each other,so lead is very easy to deposit with tin on the strip surface during the electroplating process.Both domestic and foreign tinplate manufacturers lack effective method and research for removing lead in tinplate coating.Since the tin electroplating process is very complex,it is very important to discover the source of lead and then it can be effectively removed from the coating by the subsequent research.Therefore,this paper analyzed the sources of lead during the electroplating and found the tin material is the main source of lead through the analysis.Due to the paragenetic mineral of Sn-Pb alloy,it is uneconomical and unpractical to remove the lead by using the low lead tin materials.Based on the chemical precipitation method which has been used in waste treatment,this paper,by using the BaSO4 coprecipitation method to reduce the lead in the plating solution,and its effectiveness are validated through experimental tests.In addition in combination with the practical production of electroplating and considering the recycling of plating solution,the process of continuous removal of lead was designed.And the corresponding anti-lead equipment was also designed and assembled according to the chemical precipitation process and the sedimentation process.The suitable process parameters of reducing the lead were gotten through the research experiments by using this equipment.The effects of operation parameters on the settling performance were analyzed and the sedimentation ability of the settling tank were studied by numerical simulations.