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Design And Preparation Of Electronic Packaging Materials With Water Vapor Resistance

Posted on:2017-05-17Degree:MasterType:Thesis
Country:ChinaCandidate:X YangFull Text:PDF
GTID:2321330503490910Subject:Chemical Engineering
Abstract/Summary:PDF Full Text Request
Epoxy resin has been widely used for electronic packaging materials because of its many characteristics,but it also has a poorly thermal conductivity which may lead the electronic components to failure for high temperature if the heat couldn't disappear in time;in addition epoxy resin is unable to resist the permeation of water vapor which can corrode the metal wires and chips. In order to enhance the thermal conductivity and water vapor resistance of epoxy resin, a kind of epoxy resin composite with high thermal conductivity and low water vapor permeability has been designed and prepared in this study, and then the influence of curing technology and filler volume to the performance of composites has been researched. As follow is the main point of this study:Firstly, a series of epoxy/Al2O3 composite has been made by high-speed shearing and curing, then the influence of curing technology and Al2O3 volume to the performance of composites has been researched. As shown from the results, the composites cured withmethylhexahy-drophthalic anhydride have better thermostability than that cured with triethylene tetramine, and the thermal conductivity and glass transition temperature of epoxy/Al2O3 composite increased with the Al2O3 filling volume increasing, thermal conductivity of epoxy/Al2O3 composite reached 1W/?m·K? when the filling volume of Al2O3 is 70wt% as the result of percolation threshold.Secondly, a series of epoxy/ OMMT composite has been made by high-speed shearing and curing,then the exfoliation and dispersion of OMMT and the influence of OMMT volume to the performance of composites has been researched. As a result, OMMT showed good dispersion by high-speed shearing and better exfoliation state. And as shown from the results, water vapor permeability of epoxy/ OMMT composite dropped to 1.77?g/m2·24h? when the volume of OMMT is only 3wt% of matrix.Lastly, a series of epoxy/Al2O3/OMMT composite has been made by high-speed shearing and curing, the performance of epoxy/ Al2O3/OMMT composite has been studied. As shown from the results, when the Al2O3 volume is 70wt% and the OMMT volume is 3wt% of matrix, thermal conductivity of epoxy/Al2O3/OMMT composite reached 1.06 W/?m·K? and water vapor permeability of epoxy/ OMMT composite dropped to0.97?g/m2·24h?. So this result indicated the thermal conductivity and water vapor resistance of epoxy resin could be enhanced dramatically by this way.
Keywords/Search Tags:epoxy resin, aluminium oxide, organic montmorillonite, thermal conductivity, water vapor resistance
PDF Full Text Request
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