Selective Preparation Of Conductive Metal Layer On Glass By Laser Surface Modification

As a transparent material, glass has such advantages as better chemical stability, and longer life. However, it only had application in some limited area because of its more stable surface structure and properties. So it is necessary to broaden its application range by surface modification.In this paper, a glass surface modification of combining nanosecond pulse ultraviolet laser(355 nm wavelength) etching with acid erosion was present. And then,metallic copper layer with high adhesion strength and good electrical conductivity was prepared on the glass surface by consecutive roughening and activating process. It showed that during the roughening, laser scanning space, laser fluence, scanning speed,and pulse frequency were the main factors affecting the glass surface micromorpholoy.Surface microstructure, roughness, etching depth, wettability, and chemical composition before and after surface modification were tested and analyzed by scanning electron microscopy and x-ray photoelectron spectroscopy. Experiments showed that the regular surface micromorphology could not be obtained by changing the scanning space. When the scanning space was close to light spot diameter, the surface was totally roughened.After acid erosion, the regular surface microstructure could be achieved. The optimal laser modification and activation parameters were found by electroless copper deposition.Large-area electroless copper deposition could be realized by NaOH rinse after acid erosion.The required energy density of laser activation modification was much lower than that of the surface modification. The relative atomic content deposited on the surface of the active catalytic point would change with the variation of laser fluence.When the laser fluence was about 10.44J/cm2, the catalytic activation was the optimal.If the fluence exceeded a certain threshold, it would cause the active layer on the glass surface to be etched away, it was disadvantageous to induce deposition of metallic copper.The copper layer with adhesion strength above 10 MPa could be obtained in the condition of optimal process parameters. The electrical conductivity of the copper layer was close to the bulk copper. The laser surface modification technology is feasible and have promising applications.