Preparation And Dielectric Properties Of Epoxy Resin Modified By POSS For Electronic Packaging

With the rapid development of the electronic packaging industry,higher requirements on the properties of epoxy resin for electronic packaging has been put forward.Lower dielectric constant and water absorption,higher thermal stability are particularly important.Polyhedral oligomeric silsesquionxanes(POSS)has a unique molecular structure and its physical and chemical properties are excellent.Compared to other nano-particles,the physical and chemical properties of polymers modified by POSS are more effective.As a new organic/Inorganic nano-particle modifier,POSS is widely used in electronic packaging,adhesives and other industries.In this paper,We have prepared several kinds of liquid POSS and filled liquid POSS into the epoxy resin E-51 to prepare composite materials,or solidified it directly into materials.Finally,we carry out a series of characterization of these materials.The main research contents include the following aspects1.The coupling OKHS is prepared by the click chemical reaction of eight vinyl POSS(OVS)and silane coupling agent KH590.Epoxy EPOSS and acrylate group MAPOSS are prepared by hydrolysis condensation reaction of silane.The structures and properties of a series of liquid L-POSS products are characterized and L-POSS shows excellent thermal stability.2.POSS/E-51 composites are prepared by adding a series of POSS into epoxy resin E-51 in low and high filling contents and then curing them.The properties of the prepared materials are characterized by dielectric constant TGA,DSC and so on.With the different kinds of POSS,the dielectric constant and the water absorption will decrease,thermal performance temperature will increase and additional performance of the composites will also be improved when the amount of the POSS additives is determinated.3.The OVS/EPOSS composite is prepared by adding OVS into epoxy EPOSS and curing EPOSS directly with the curing agent polyether amine D230.EPOSS Materials are made by curing EPOSS singly with four different curing agents and curing EPOSS togetherly with two kinds of curing agents in different content ratio.At the same time,the performance of the three kinds of materials are characterized by dielectric constant and TGA etc.The electrical and thermal properties of epoxy EPOSS materials are excellent.