Preparation Of Benzimidazole-Functionalized Graphene Oxide And The Application In Epoxy Resin

Epoxy-anhydride have excellent dielectric properties.But the high curing temperature have limited its application Benzimidazole can be curing catalytic in epoxy-anhydride due to the tertiary amine.Graphene oxide(GO)is the oxidation product of graphene.The existence of oxygen-containing group provide it with a good dispersity and possibility of chemical modification.So we propose functionalize GO with benzimidazole to catalyze curing reaction and enhanced the mechanical properties for epoxy resin.And we also study the curing kinetics of benzimidazole functionalized graphene oxide(GO-BMI)/Epoxy-anhydride system.Main results are shown as follow:(1)In the presence of polyphosphoric acid,the GO and CFGO have a reaction with o-phenylenediamine to prepare GO-BMI and benzimidazole functionalized carboxyl graphene oxide(CFGO-BMI).The GO-BMI and CFGO-BMI was examined by FITR,XRD,XPS and elemental analysis.(2)We have proven that GO-BMI and CFGO-BMI have effective catalyst for the curing reaction of epoxy-anhydride system by DSC.The catalyst effect of GO-BMI and CFGO-BMI are not much difference.So we only study the mechanical properties of GO-BMI/epoxy composites in follow-up work.In the epoxy-4,4-diaminodiphenyl methane(DDM)system,the tensile strength,flexural strength and impact strength reach top in the content of GO-BMI is 0.08 wt%.In the epoxy-4-methyl tetrahydrophthalic anhydride(MeHHPa)system,the flexural strength and impact strength reach top in the content of GO-BMI is 0.27 wt%.Compared with the pure epoxy,they increased 65%and 55%respectively.And the tensile strength don't have a evident change.(3)The non-isothermal curing kinetics of GO-BMI accelerate EP-MeHHPa curing system was investigated by DSC.The apparent activation energy(Ea)of GO-BMI accelerate EP-MeHHPa curing systems were calculated by Kissinger method.We found that the incorporation of GO-BMI can reduce Ea of GO-BMI accelerate EP-MeHHPa curing systems effectively.According to Malek method,we choose Sestak-Berggren model to describe the non-isothermal curing kinetics of GO-BMI accelerate EP-MeHHPa curing systems.It have a well simulation of GO-BMI accelerate EP-MeHHPa curing systems.