Research On Mechanical Properties Of Metal Film On Perforated Flexibility Substrate

With decades of continuous development of science and technology,especially the flexible of appearance and development of electronic materials,has been widely applied in micro/nano-scale electronic device,biological materials and other fields.The free-stranding metal film could fracture by a low tension strain.Therefore improving strain of the free-stand metal film on the flexible substrate has important significance on the life and conditions of applying.Base on the above factors,this paper through numerical simulation and experiments means studies the deformation status and crack process of thin metal films on flexible substrates.To begin with,we through the finite element analysis software(ABAQUS)discus and design a substrate which has s special mechanical property-‘auxetic',and use the Python script to come true the pre-processing and post-processing.We can find out a values of the Poisson's ratio which is equal to about-0.75.Furthermore,we take account into the cohesive zone mode(C ZM)to study the deforming and ?crack of metal films on the elastic substrates under uniaxial tension,and analysis the effects of cohesive element parameter and substrate structure to delay the crack development.Finally,we use two components of silicone rubber material to preparation appropriate substrate,and the film through a method of dc-magnetron sputtering Physical vapor deposition(PVD)on the substrate.We place it in the self-made small tensile device and uniaxial tension,by measuring the change of metal film resistor with Agilent semiconductor analyzer and observing the generation of microstructure crack of metal film with Optical Microscope,to evaluate the mechanical properties of metal film on flexible substrate.Results and research method in this context can provide some practical significance for structure design of flexible electronic substrates.