Research And Development Of High Performance Epoxy Molding Compounds

In the formula of epoxy molding compounds,the proportion of inorganic filler is more than the proportion of organic components.When the inorganic filler is excessive,the dispersion of inorganic filler in the epoxy resin will be influenced by its particle size,the trend of agglomeration and poor compatibility with epoxy resin,therefore the development and application of epoxy molding compounds will be also negatively affected.In addition,when using the epoxy molding compounds,epoxy can be cross linked with curing agent.The curing accelerator determines the reaction process of curing cross-linking and the performance of the curing products of epoxy molding compound.As a result,it is important to choose an effective curing accelerator.In order to solve the above problems in the formula of epoxy molding compounds,the modification of inorganic filler and research on properties of epoxy molding compounds were carried out to obtain higher performance,the main experimental contents are as follows:Barium titanate powders were modified with silane coupling agent?-(2,3-epoxypropoxy)propytrimethosysilane,the effects of different hydrolysis pH,hydrolysis time and different treatment processes on the modification were investigated.The BTO powders before and after modified were subjected to infrared spectroscopy,contact angle test and electron microscopy scanning test,and the measurement of the spiral flow length and gel time of the corresponding epoxy molding compound and the electron microscopy test were carried out to obtain the optimal process condition of surface modification of BTO powders.The experimental results show that the dispersion of BTO powders treated by KH560 hydrolysate is favorable in the epoxy resin,and the spiral flow length and gel time of the epoxy molding compound are improved.BTO powders added into the silane coupling agent KH560 hydrolysate,which can be obtained under pH=1 circumstance after 4 hours,can get the optimal modification.Five curing accelerators including 2-ethyl-4-methylimidazole,2-Isopropylimidazole,triphenylphos-phine,1,5-Diazabicyclo[4.3.0]non-5-ene,1,8-Diazabicyclo[5.4.0]undec-7-ene,were used in the formula of epoxy molding compound to study the effects of different curing accelerators on the performance ofepoxy molding compounds.The spiral flow length,gel time and thermal hardness of the five corresponding epoxy molding compounds were measured,five kinds of epoxy molding materials were subjected to DSC scanning,activation energy and reaction order of epoxy molding compound curing reaction were calculated by Kissinger equation and Crane equation.The curing products were tested by electron microscopy,and the curing accelerators with better catalytic performance were found by comparison.Then the basic data will be provided for the improvement and optimization of the epoxy molding compounds.