Mechanical Properties Of Laser Micro Processing Surface Research

The micro machine is playing a vital role in the development of the society,especially the microprocessing of micro components has become a hot research project.Because the laser processing technology has a high energy concentration,good controllability and non-contact processing characteristics,the laser microprocessing of micro components have a wide range of applications in the manufacturing area.Currently,the study of the laser processing technology mainly focuses on the processing areas such as the production and the machine development,while the study of its basic theory is still lagging behind,especially for the laser microprocessing technology whose theoretical study is more rare.However,the mechanical properties of the surface of the laser microprocessing and other processing techniques have obvious differences,the original theory and cognition are not suitable for laser microprocessing surface,which severely restricts the further development of laser microprocessing technology.The paper sums up the general rules by studying the mechanical properties of the laser microprocessing surface,which can provide effective measurement for the performance of the laser microprocessing parts.Meanwhile,it can improve the processing quality and prepare for developing a scientific and rational surface roughness evaluation parameter system and effective testing methods.It also provide a theoretical basis for the selection of equipment or processing methods,which can raise the level of China's laser microprocessing technology.It has not only important academic value and strategic significance but also significant economic and social benefits.For the measurement of laser microprocessing basic parameters,the paper designs a precise pulse waveform measuring instrument.It aims to capture the laser pulse waveform changes quickly and accurately,measure parameters accurately such as pulse width and pulse interval,and provide accurate data for measuring laser microprocessing basic parameters.Through analyzing the thermal physical changes of the micromachining process,it establishes the heat balance equation.Combined with simulation software,it simulates a temperature distribution of the laser microprocessing,which provides a theoretical basis for the subsequent analysis of the microstructure and the surface mechanical performance.Then,with the analysis of metallurgical structure and heat physical processes,it summarizes the general variation of laser microprocessing microstructure.It also proposes that new compositions are generated in the heat physical process,which is the fundamental reason for the changes of the metallurgical structure and the mechanical properties of the whole surface.Moreover,by studying the micro hardness,surface corrosion,surface residual stress,and other aspects,it gets the trends of pulse energy and surface depth with thermodynamic and microstructure analysis.By analyzing laser microprocessing surface cracks,it works out the laws of the physical and mechanical properties of the laser microprocessing surface.As discussed above,it finally forms a complete surface mechanical properties evaluation system of the laser microprocessing and provides a scientific assessment standard and strong theoretical support for improving the quality of laser microprocessing.It has laid a solid foundation for the further development of the cuttingedge basic research of the laser microprocessing.