Numerical Simulation Of Transverse Tension For Unidirectional C/SiC Composites

C/SiC composites,the most widely used representative in ceramic matrix composites,still has great development value in areas of military and civilian.Although diamond wheel grinding is the most promising machining method of ceramic matrix composites,it is not clear about he influence of interface as complicated microscopic-structure on grinding mechanism.So far,little attention has been paid to transverse mechanical properties of C/SiC composites,and obviously the study about interface de-bonding under transverse tensile load was insufficient,which severely restricted the application and development of C/SiC composites.Based on research method of micro-mechanics,the thermal residual stress distribution and factors of the unidirectional C / SiC composites,the stress state distribution of interface as well as the transverse tensile mechanical properties are studied by ways of mathematical modeling calculation,finite element numerical simulation and tensile test in this paper.Based on the method of elasticity mechanics,this paper analyses the characteristics of the preparation process and the causes of thermal residual stress,and predicts the distribution rules of thermal residual stress within the cross section on the radial and circumferential.The interface stress state,de-bonding and the effect of the model parameters on interface stress distribution rules are analysed under transverse tensile load.And furthermore,the de-bonding order and condition of interface cohesion element are researched by numerical simulation method.With ABAQUS software,the numerical simulation research on the preparation of C/SiC composites is developed,which reveals the influence rules of the fiber arrangement mode,fiber volume fraction,interface thickness and preparation temperature on the thermal residual stresses of the composites.The paper analyses the stress-strain curve,which is obtained by transverse tensile test,to research the transverse brittle fracture mechanism of C/SiC composites,and explores the effects of fiber on intensity of ceramic matrix.combined with the numerical simulation research,the result of interface de-bonding strength is 14.7 MPa for specific parameters.This paper studies,considering thermal residual stress,microscopic mechanical behavior of C/SiC composites on the condition of transverse tensile load.The research conclusion will be helpful to reveal the interface failure mechanism,and to improve the interfacial constitutive relations.All the work can provide method and theoretical basis for composite material design and manufacturing of grinding.