Surface Modification And Thermal Performance Of A Modified Graphene Oxide/Novolac Epoxy Composite

With the development of electronic industry,electronic products are becoming more and more powerful.But the high integration of electronic components also brings about the problem of heat dissipation.Aiming at this problem,the interface thermal conductive material was born.The development and improvement of technology prompted us to search for better thermal conductivity filler and better interfacial thermal conductive matrix materials.The highest thermal conductivity of the known materials is graphene,whose thermal conductivity can reach 5300W/m·K.However,as inorganic carbon material,graphene has poor compatibility with the polymer matrix.Fortunately,the surface of graphene oxide(GO)has active functional groups.Surface modifcation of GO can be alleviated by these functional groups,thus alleviating the poor compatibility and agglomeration of the polymer matrix.Adding modified GO to polymer matrix can reduce the air of the interface and reduce the influence of air on the thermal conductivity of interface thermal conductive material.Therefore,it is a good choice of interfacial thermal conductive material filler.Novo lac epoxy resin,which has excellent phenolic resin and epoxy resin properties,is excellent in heat resistance,corrosion resistance and physical and mechanical properties.It can be used as the substrate of the interface thermal conductive material.The article first prepared GO as raw materials.Then grafted organic molecules on the surface of GO.Finally the surface modified GO was obtained.The infrared spectrum test(FTIR),transmission electron microscopy(TEM)shows that the surface of GO has been successfully grafted with organic molecules.The modified GO,novo lac epoxy resin and curing agent were mixed by hot pressing at different ratios,so that the modified GO interfacial thermal composites were obtained.The scanning electron microscope test(SEM)shows that the dispersion and the compatibility within the matrix were improved.Thermogravimetric analysis(TG)shows that the residue weight at 600? increased gradually from 30.03%to 44.67%with the addition of modified GO.The temperature of maximum decomposition rate increased from 388? to 396 ?.The above analysis proves that modified GO raised the thermal stability of the thermal conductivity composite.Dynamic thermomechanical analysis(DMA)shows that the Tg reached 222 ? when the weight percentage of modified GO reached 36.8%,which increased by 60 ? than that of pure novolc epoxy resin.The thermal conductivity of the composite increased from 0.044 W/m·K to 1.096 W/m· K gradually.It can be speculated that adding modified GO into the resin matrix is an effective way to prepare the interface thermal conductive material...