Research On Life Prediction Method Of Electronic Product Combined Multiple-failure Mechanism

Electronic products are often subject to complicated environment in service and transportation, expediting the failure of products. In order to ensure the electronic products compliance with the requirements on reliability and service life, it's significant to establish the service mode under the coupling of multi-failure mode. It can provide technical support for the reliability research and test program design of such complex products as electron components. This paper mainly studies: the electronic product reliability theory was reviewed and discussed based on physics of failure. Modes and mechanism of electron components are analysis especially. Based on the aforesaid, the failure mode of electronic product under the single effect of thermal cycle, random vibration and electrical stress was established respectively. On the basis of fundamental assumption of the life prediction over the physics of failure and modeling approach, the life prediction method that integrates the mutual function of multi-failure mechanism was put forward, the life prediction model for single component, part and system under the circumstance of multi-failure mechanism, was established and the reliability and life prediction model of components and parts under the circumstance of incomplete antagonism was further discussed. Moreover, the present work highlights the failure mechanism for electron components by two inter-dependent failure modes: thermal cycle and random vibration. The stress-strain state of BGA(Ball Grid Array) at thermal cycle and random vibration was investigated using FE. Meanwhile, the multi-failure mechanism coupling life prediction model was used to predict the failure life of the welding spot under the combined stress action. By comparing the simulation results and the test results given by Haiyu Qi, the feasibility and effectiveness of the method was verified herein.In conclusion, through theory modeling, simulation analysis and test verification, the life prediction method of electronic product under multi-failure mechanism is studied. In the service process, electron components undergo the mutual action of various environmental stresses, which expedites the failure of electron components. Here, the proposed method analyzes the electronic failure from the perspective of physics of failure and can relatively accurate predict its service life in complicated environments. The research result can be conducive to the life prediction of electronic products that undergo the combined multi-failure mechanism in complicated environments.